Date: Tuesday, September 20th, 2016
Time: 8 AM PDT [GMT -07:00]
This Open-Silicon webinar, moderated by Brian Bailey of Semiconductor Engineering, addressed key considerations when selecting and integrating IP into ASIC/SoC designs. No longer can the procurement and integration of third-party IP be done in isolation as just an IP block. System issues associated with choosing the right hardware, appropriate firmware and optimum embedded software in which the ASIC/SoC will fit, is now the biggest driver for third-party IP procurement. As a result, navigating the many challenges associated with blending diverse IP from multiple vendors, increasing software complexity, design challenges in process manufacturing, hardware implementation and emulation, trade-offs in system architecture, and maintaining compliance with ever-evolving standards, is the key to successful integration and first-pass silicon. Those joining the webinar learned what third-party IP vendors and turnkey ASIC solutions providers are doing from a system perspective down to the transistor level, to not only mitigate these challenges and facilitate seamless integration, but reduce cost and incorporate greater flexibility and functionality while maintaining the system perspective using pre-verified and customized IP blocks. The panelists delved deep into the architectural deliverables, trade-offs on IP selection, and quality benchmarks that enable the best performance of an ASIC/SoC for any specified application or operating condition. This included compatibility assurances across all of the IPs front/back-end views and deliverables within any specific tool flow, as well as the foundry processes. Other topics discussed included system level checklists, integration checklists, integration reviews, tape-out reviews, certifications, evaluation boards and more.
This webinar was ideal for system architects, hardware designers and ASIC/SoC engineers.
Brian is an electrical and electronic engineer, who spent the first part of his career working on commercial RTL simulation, hardware accelerators, multi-level mixed signal simulation and hardware-software co-verification. He holds four patents, has been active in a number of standards groups, written numerous papers, and served as a regular blogger, writer and voice of reason on numerous publications in the electronics industry
Brian Bailey – Moderator
Senior Director, IP Sourcing
Elias serves as Senior Director of IP Sourcing for Open-Silicon. He helps procure and qualify a wide variety of analog, mixed-signal and digital IP. Elias has over 25 years of specialized experience in the analog, mixed-signal and digital design markets. He is well versed in project implementation working in the forefront of VLSI/mixed-signal/analog technology, design and back/front-end ASIC methodologies. Elias has demonstrated proven success in implementing complex custom SoCs with first time working silicon. Prior to joining Open-Silicon, Elias held various IP engineering and management roles at RAMBUS, National Semiconductor and LSI Logic. Elias holds a master’s degree in electrical engineering from Washington State University.
IP Solutions Manager
Vamshi serves as IP Solutions Manager for Open-Silicon. He is responsible for managing third-party IP function, which involves selection, procurement, quality check and integration of various enterprise and consumer application IPs. Prior to joining Open-Silicon, Vamshi was Hard IP Applications Engineer at Intel. Prior to that, he served as Product Applications Engineer at MosChip Semiconductor, where he was responsible for IP/product quality checks, delivery and support. Vamshi holds a bachelor’s degree in electronics and communications engineering from Kakatiya University, India.
Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers’ products by innovating at every stage of design — architecture, logic, physical, system, software and IP — and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing and test capabilities. The company has partnered with over 150 companies ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300+ designs and shipped over 120 million ASICs to date. Privately-held, Open-Silicon employs over 250 people in Silicon Valley and around the world. www.open-silicon.com