What: Open-Silicon presented a paper on “Physical Planning and Implementation of a High Bandwidth Memory (HBM2) based 2.5D ASICs in FinFET Technologies” at SemIsrael 2017. The presentation was delivered by Huzefa Cutlerywala, VP of Technical Solutions, EMEA, Open-Silicon.
When: 14:20 – 14:40 on November 28, 2017.
Where: Physical Design Track, SemIsrael Expo 2017,
Avenue Convention Center, Airport City.