Edition 1, January 2015
PRESS RELEASES (Q4 2014) 

 

Open-Silicon™ Announced Availability of World's First HMC 2.0 Memory Controller IP

 
Delivers Critical IP to Address Growing Bandwidth Needs of Next-Generation Networks

 

November 19, 2014 - Open-Silicon today announced a comprehensive Hybrid Memory Cube (HMC) 2.0 controller solution as licensable Intellectual Property (IP) that will enable SoC designers to take immediate advantage of the performance gains afforded by the emerging memory standard. Read on...

Open-Silicon™ Discussed SoC Debug, Prototyping and Simulation Methods at IP-SoC 2014 Conference in Grenoble

 

November 4, 2014 - Showcasing its extensive background in SoC debug and prototyping, Open-Silicon, an ASIC solutions provider, today announced it will participate in the IP-SoC Conference with three presentations during the SoC Debug, Prototype and Simulation Session. Read on...

INDUSTRY EVENTS (Q4 2014) 

 

VIDEOS AND ARTICLES 
(Q4 2014) 

 

ABOUT OPEN-SILICON
Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers' products by innovating at every stage of design - architecture, logic, physical, system and software - and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing and test capabilities. The company has partnered with over 150 companies ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300 designs and shipped nearly a hundred million ASICs to date. To know more visit: www.open-silicon.com

 

OPEN-SILICON IN THE NEWS (Q4 2014) :

 

An Inside Look At The GlobalFoundries-IBM Deal...

 

Conflicting Needs For IoT Edge Designs...

 

Hybrid Memory Cube Consortium Releases New Specification...

 

Micron displays Hybrid Memory Cube at SC14 as HMCC spec is finalized...

 

Virtual Prototyping Takes Off...

 

A New Reuse Paradigm To Take 2.5D Packaging Technology Mainstream...

 

2.5D Timetable Coming Into Focus...

 

Why Is My Device Better Than Yours?

 

Symmetry Electronics Announces New Worldwide Distribution Agreement with Open-Silicon...