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Taher Madraswala, President and CEO

Taher Madraswala has more than 25 years of semiconductor engineering and business management experience. Taher joined Open-Silicon at its inception to help realize a vision of making ASICs affordable. Before taking over as Open-Silicon’s President in 2014 and as President and CEO in 2015, Taher served as COO and Vice President of Engineering. He has contributed his technical and business experience to building Open-Silicon’s full turnkey ASIC offering with flexible engagement models. Prior to joining Open-Silicon in 2003, Taher spent twelve years at Intel Corporation designing VLIW video processors for the DVI platform and microprocessors where he contributed to logic, circuit, layout and post-silicon debug of 486, Pentium, Pentium-MMX, Pentium-3 and Itanium processors. In addition, as an engineering manager at Intel, he oversaw ASIC development in the DSL Modem and Optical Networking Group. Over his career, Taher has demonstrated his commitment to quality engineering across more than 300 tapeouts. Taher has a master’s degree in Computer Engineering from the University of Louisiana, Lafayette and a bachelor’s degree in Electrical Engineering from Aligarh University.

We are committed to ensuring an unparalleled customer experience that results in the successful delivery of optimized solutions for our customers’ ideas and products.

Jay Vyas, SVP and Chief Financial Officer

Jay Vyas has more than 20 years of experience in the areas of financial accounting, management, reporting and analysis. Formerly the Vice President of Finance and Corporate Controller at Oxford Semiconductor, Jay led the development of a comprehensive internal control structure along with financial and accounting systems. Before Oxford, he was Vice President of Finance for Semiconductor Operations at Cree and led a successful spin off of Ultra RF, the Semiconductor Division of Spectrian. Jay received his accounting degree from the University of London.

By aggregating the supply chain orders of many customers and maintaining tight internal cost controls, Open-Silicon has made ASICs affordable again.

Mark Wright, SVP of Sales and Marketing

Mark Wright, Senior Vice President of Sales and Marketing, has demonstrated success in building and managing sales and marketing organizations for a variety of semiconductor and ASIC companies. At Open-Silicon, he applies his 25+ years of experience to ensure best-in-class sales coverage and drive design wins with system companies and startups across the globe. Prior to joining Open-Silicon, Mark was President of Faraday Technology Corporation, USA, a fabless ASIC / SoC and silicon IP provider. Prior to his role as President, he worked for five years as Faraday’s Vice President of Sales, and an additional four years as Area Sales Manager where he managed both national and international sales teams and was responsible for the promotion of the company’s ASIC technology. While at Faraday, Mark was the early adopter of leading-edge technology, winning first designs at 90, 65, 55, 40 and 28nm. Prior to Faraday, Mark was Regional Sales Manager for Chip X. He has also held various management and sales positions for companies such as Southern States Marketing, Nu Horizons and Arraytech Sales. Mark holds a bachelor’s degree from the University of North Texas.

Providing unmatched service, transparency and execution to customers is the key for continuous growth at Open-Silicon.

Vasan Karighattam, VP of Engineering

Vasan Karighattam is Vice President of Engineering at Open-Silicon, responsible for architecture, SoC design and verification, as well as system software and post-silicon validation. Prior to Open-Silicon, Vasan led the development of next-generation architectures of MDSL / HDSL transceivers and service framers, and was a key participant in the standards activity for the IEEE 802.17 Resilient Packet Ring MAC in the Optical Components group at Intel Corporation. He also worked for several years on next-generation architecture and front-end development of SoCs for tablets and smart phones. Vasan’s 25 years of semiconductor engineering experience also includes positions at Level One Communications, LSI Logic, Acuson Corporation and Protocol Engines. Vasan holds a master’s degree from Michigan Technological University at Houghton and a bachelor’s degree from Bangalore University.

Front-end design capability is one of Open-Silicon’s key differentiators. Our enhanced focus to work with the customer at the specification level allows us to provide them with an even wider selection of cost-effective solutions.

Asim Salim, VP of Manufacturing Operations

Asim Salim brings in 20 years of experience in semiconductor operations to the role of Vice President of Manufacturing Operations at Open-Silicon. Prior to joining Open-Silicon, he managed operations at Oxford Semiconductor, where he was responsible for all aspects of manufacturing operations for storage devices. Before Oxford, he held progressively responsible positions at Centillium Communications, S3 Inc. and Quality Semiconductor (acquired by IDT). During his career, Asim has demonstrated operations leadership by taking several types of products (networking, consumer, GPU, mobile) into high-volume production. Asim holds a master’s degree in science (EE) from the University of Waterloo, Canada and a bachelor’s degree in electrical engineering from Aligarh Muslim University, India. He has published several technical papers in refereed conferences and journals in the area of semiconductor devices and sensors.

Semiconductor companies need to get new ideas and products to market quickly. Open-Silicon’s vertical-specific offerings in platforms and IP provide its customers with a unique leverage to help them get those products to market faster.