Download or Request: Submit ASIC Requirements for Quote 28G SerDes Evaluation Platform Virtual Prototyping Brochure HMC ASIC IP Product Brief

Open-Silicon to Present: FlexE IP – A New Flexible Ethernet Client Interface Standard

Design & Reuse IP SoC Day 2018 in Santa Clara Milpitas, CA – April 3, 2018 – Open-Silicon, a system-optimized ASIC solution provider, will present “FlexE IP – A New…




Open-Silicon, Credo and IQ-Analog Showcase Complete End-to-End Networking ASIC Solutions at OFC 2018

               SAN DIEGO, March 12, 2018 (GLOBE NEWSWIRE) — Open-Silicon, Credo and IQ-Analog will participate in joint demonstrations at the Optical Fiber Communications Conference (OFC) 2018…




Open-Silicon Receives TSMC OIP Ecosystem Forum Customers’ Choice Award for Best Paper

High Bandwidth Memory (HBM2) IP Subsystem Solution Validation and Interoperability with HBM2 Memory Die Stack MILPITAS, Calif., Jan. 16, 2018 (GLOBE NEWSWIRE) — Open-Silicon, a system-optimized ASIC solution provider and…




Open-Silicon Expands Networking IP Portfolio to Address High-Bandwidth Ethernet Endpoint and Ethernet Transport Applications

Comprehensive IP subsystem includes Interlaken, Ethernet PCS, Flex Ethernet and Forward Error Correction IPs MILPITAS, Calif., Nov. 13, 2017 (GLOBE NEWSWIRE) — Open-Silicon today announced the availability of a comprehensive…




Open-Silicon to Present at the IEEE Electronic Design Process Symposium (EDPS) in Milpitas, CA

MILPITAS, CA–(Marketwired – September 19, 2017) – Open-Silicon, a system-optimized ASIC solution provider, today announced that its vice president of manufacturing operations, Asim Salim, will present “High Volume Manufacturing Supply Chain…




Open-Silicon Completes Successful Silicon Validation of High Bandwidth Memory (HBM2) IP Subsystem Solution

Open-Silicon Completes Successful Silicon Validation of High Bandwidth Memory (HBM2) IP Subsystem Solution Silicon validation in TSMC’s 16nm FinFET technology and interoperability with HBM2 memory; Silicon-proven SoC solution enables next…




Open-Silicon to Participate in Panel Discussions and Booth Demonstration at DAC 2017

Panel discussions on IP growth and SoC design challenges; IoT edge SoC platform and gateway SoC reference design demonstration in ARM Approved Design Partner booth MILPITAS, CA–(Marketwired – June 14,…




Open-Silicon Unveils Industry’s Highest Performance Interlaken Chip-to-Chip Interface IP

Supports up to 1.2 Tbps and up to 56Gbps SerDes rates Milpitas, CA – April 4, 2017 – Open-Silicon, a system-optimized ASIC solution provider and founding member company of the…




GreenWaves Technologies Partners with Open-Silicon to Develop Industry’s First IoT Processor Based on PULP and RISC-V

Open-Silicon tapped for ultra-low power physical design and CPU core hardening experience MILPITAS, CA–(Marketwired – March 13, 2017) – Open-Silicon, a system-optimized ASIC solution provider, today announced it was selected…




Open-Silicon Announces IoT Gateway SoC Platform

Multiple IoT solutions, including smart city and industrial, are possible with a single gateway SoC MILPITAS, CA–(Marketwired – March 13, 2017) – Underscoring its commitment to the IoT market, Open-Silicon…




← Older news