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Open-Silicon to Showcase its Comprehensive IP Subsystem Solution for High-End Networking Applications, and Demonstrate its High Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance Computing Applications at OFC 2018…

Open-Silicon, a system-optimized ASIC solution provider, will showcase its Comprehensive IP Subsystem Solution for High-End Networking Applications, and demonstrate its Comprehensive High Bandwidth Memory (HBM2) IP Subsystem Solution for 2.5D…




Open-Silicon Showcases its 2.5D ASIC SiP Capabilities and Breadth of ASIC Solutions, Including its HBM2 IP Subsystem Solution and its Comprehensive Networking IP Subsystem Solution, at DesignCon 2018….

Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at DesignCon 2018 in Santa Clara, CA on Jan. 31 and Feb. 1, 2018. The company will showcases its 2.5D ASIC SiP…




Open-Silicon to Demonstrate its High Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance Computing Applications and Showcase its Comprehensive IP Subsystem Solution for High-End Networking Applications at REUSE 2017…

Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at REUSE 2017 in Santa Clara, CA on December 14, 2017. The company will demonstrate its comprehensive high bandwidth memory (HBM2)…




Open-Silicon Speaks on “Physical Planning and Implementation of a High Bandwidth Memory (HBM2) based 2.5D ASICs in FinFET Technologies” at SemIsrael 2017…

What: Open-Silicon presented a paper on “Physical Planning and Implementation of a High Bandwidth Memory (HBM2) based 2.5D ASICs in FinFET Technologies” at SemIsrael 2017. The presentation was delivered by Huzefa…




Open-Silicon to Demonstrate its High-Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance Computing Applications and Showcase its Networking IP Subsystem for High-Bandwidth Networking Applications at SC17…

Open-Silicon to Demonstrate its High-Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance Computing Applications and Showcase its Networking IP Subsystem for High-Bandwidth Networking Applications at SC17… Open-Silicon, a system-optimized…




Open-Silicon to Demonstrate its High Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance Computing and Networking Applications and Showcase its IoT Gateway SoC Reference Design for Smart City Applications at ARM TechCon 2017…

Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at ARM TechCon 2017. The company will demonstrate its comprehensive high bandwidth memory (HBM2) IP subsystem solution for 2.5D ASICs in FinFET technologies….




Open-Silicon to Exhibit at GTC, Munich to Demonstrate its Comprehensive HBM2 IP Subsystem Solution for 2.5D ASICs…

Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at GTC (GlobalFoundries Technical Conference), Munich on October 13, 2017. The company will demonstrate its Comprehensive High Bandwidth Memory (HBM2) IP Subsystem…




Open-Silicon to Exhibit at GSA Entrepreneurship Conference, Belgium to demonstrate its IoT Edge SoC Platform Solution, IoT Gateway SoC Reference Design and Comprehensive HBM2 IP Subsystem Solution for 2.5D ASICs in TSMC 16nm FF+…

Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at GSA Entrepreneurship Conference, Leuven, Belgium on September 27, 2017. The company will demonstrate its IoT Edge SoC Platform Solution, IoT…




Open-Silicon to demonstrate its Comprehensive HBM2 IP Subsystem Solution for 2.5D ASICs in TSMC 16nm FF+ and present a technical paper at TSMC OIP 2017 in Santa Clara…

Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at TSMC Open Innovation Platform® (OIP) Ecosystem Forum 2017 in Santa Clara. The company will demonstrate its Comprehensive High Bandwidth Memory…




Open-Silicon to showcase its Comprehensive HBM2 IP Subsystem Solution for 2.5D ASICs in TSMC 16nm FF+ and present a technical paper at CDNLive 2017 in Bangalore…

Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at CDNLive 2017 in Bangalore, India to showcase its comprehensive High Bandwidth Memory (HBM2) IP Subsystem Solution for 2.5D ASICs in TSMC…




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