Download or Request: Submit ASIC Requirements for Quote 28G SerDes Evaluation Platform Virtual Prototyping Brochure HMC ASIC IP Product Brief

Author admin



» Author's Latest Posts


Open-Silicon to Showcase its Comprehensive IP Subsystem Solution for High-End Networking Applications, and Demonstrate its High Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance Computing Applications at OFC 2018…

Open-Silicon, a system-optimized ASIC solution provider, will showcase its Comprehensive IP Subsystem Solution for High-End Networking Applications, and demonstrate its Comprehensive High Bandwidth Memory (HBM2) IP Subsystem Solution for 2.5D…




Open-Silicon Receives TSMC OIP Ecosystem Forum Customers’ Choice Award for Best Paper

High Bandwidth Memory (HBM2) IP Subsystem Solution Validation and Interoperability with HBM2 Memory Die Stack MILPITAS, Calif., Jan. 16, 2018 (GLOBE NEWSWIRE) — Open-Silicon, a system-optimized ASIC solution provider and…




Open-Silicon Showcases its 2.5D ASIC SiP Capabilities and Breadth of ASIC Solutions, Including its HBM2 IP Subsystem Solution and its Comprehensive Networking IP Subsystem Solution, at DesignCon 2018….

Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at DesignCon 2018 in Santa Clara, CA on Jan. 31 and Feb. 1, 2018. The company will Open-Silicon Showcases its 2.5D…




Open-Silicon IP Targets Networking

MICROPROCESSOR report   –   Most Significant Bits Open-Silicon IP Targets Networking By Bob Wheeler,  December 12, 2017 Better known as an ASIC vendor, Open-Silicon is expanding its intellectual-property (IP) portfolio. It’s…




Open-Silicon Expands Networking IP Portfolio to Address High-Bandwidth Ethernet Endpoint and Ethernet Transport Applications

Comprehensive IP subsystem includes Interlaken, Ethernet PCS, Flex Ethernet and Forward Error Correction IPs MILPITAS, Calif., Nov. 13, 2017 (GLOBE NEWSWIRE) — Open-Silicon today announced the availability of a comprehensive…




Open-Silicon to Demonstrate its High Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance Computing Applications and Showcase its Comprehensive IP Subsystem Solution for High-End Networking Applications at REUSE 2017…

Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at REUSE 2017 in Santa Clara, CA on December 14, 2017. The company will demonstrate its comprehensive high bandwidth memory (HBM2)…




Enabling High-Bandwidth Networking Applications with Multi-Channel Multi-Rate Forward Error Correction (MCMR FEC) IP

Date: Thursday, December 7, 2017 Time: 8 AM PST/ 11AM EST To view this webinar recording please Email to info@open-silicon.com. About the Webinar: This Open-Silicon webinar, moderated by Eric Esteve of SemiWiki,…




Open-Silicon Speaks on “Physical Planning and Implementation of a High Bandwidth Memory (HBM2) based 2.5D ASICs in FinFET Technologies” at SemIsrael 2017…

What: Open-Silicon presented a paper on “Physical Planning and Implementation of a High Bandwidth Memory (HBM2) based 2.5D ASICs in FinFET Technologies” at SemIsrael 2017. The presentation was delivered by Huzefa…




Open-Silicon to Demonstrate its High-Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance Computing Applications and Showcase its Networking IP Subsystem for High-Bandwidth Networking Applications at SC17…

Open-Silicon to Demonstrate its High-Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance Computing Applications and Showcase its Networking IP Subsystem for High-Bandwidth Networking Applications at SC17… Open-Silicon, a system-optimized…




Open-Silicon to Demonstrate its High Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance Computing and Networking Applications and Showcase its IoT Gateway SoC Reference Design for Smart City Applications at ARM TechCon 2017…

Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at ARM TechCon 2017. The company will demonstrate its comprehensive high bandwidth memory (HBM2) IP subsystem solution for 2.5D ASICs in FinFET technologies….




← Older news