Hybrid Memory Cube
A Revolution in Performance and Power
Micron’s HMC technology is a new architecture unique to the market today. It combines fast logic process technology with advanced DRAM, resulting in a memory system with revolutionary performance and power in a dramatically reduced footprint. As multi-core processing continues to advance semiconductor design to new levels, this technology provides memory and performance ideally suited to these next-generation systems.
The Real Difference is in the Cube
HMC will provide a revolutionary performance shift that will enrich next-generation networking and enable exaflop-scale supercomputing:
- Increased Bandwith — a single HMC can provide more than 15x the performance of a DDR3 module.
- Power Reductions — HMC is exponentially more efficient than current memory, using 70% less energy per bit than DDR3.
- Smaller physical systems — HMC’s stacked architecture uses nearly 90% less space than today’s RDIMMs.
