Focus on unique OpenModel and low-power technologies

MILPITAS, Calif. – February 23, 2010: Open-Silicon, Inc., a leading ASIC design and semiconductor manufacturing company, announced today that it has launched Open-Silicon Japan with headquarters in the Landmark Tower, Yokohama, Japan. The company has already secured its first Japanese customer.

Open-Silicon’s expansion to Japan enables the company to support the escalating demand for low-power ICs—both next-generation ASICs and “power-down derivatives”—which are required in the mobile, consumer, networking, and server products that come from Japan. Open-Silicon offers a strong low-power capability with its PowerMAX technology, which provides low-power design techniques like back biasing, custom low power cells, and power recovery. The company also recently joined the Power Forward Initiative, a low-power industry group.

“As Japanese semiconductor companies consolidate and go to a fab-lite model for 40nm, 28nm, or 22nm, the trend is to shift to foundry-based silicon for which Open-Silicon is a great fit,” said Rick Murayama, managing director of Open-Silicon Japan. “Our predictability and reliability enable customers to enjoy the same high level of quality and service they have enjoyed from the large traditional IDMs.”

Open-Silicon attributes much of its success to the OpenMODEL™, the semiconductor industry's first end-to-end custom SoC development solution based on a revolutionary business model that provides a seamless, low-cost, and low-risk alternative to traditional models for complex ASIC design and development. Designers can choose their foundry, package supplier, and IP from any available on the open market, or they can ask Open-Silicon to propose complete solutions leveraging the best available technology. In addition, Open Silicon continues to broaden its ecosystem partnerships and expand it design capabilities. The company recently acquired Silicon Logic Engineering (SLE) to increase the front-end capabilities for designing derivative ICs, which are increasingly in demand as semiconductor companies look to maximize the returns on their initial platform IC investments.

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on SoC realization for traditional ASIC, develop-to-spec, and derivative ICs. Open-Silicon’s OpenModel brings together Open-Silicon’s engineering technology and high-quality manufacturing services with one of the broadest partner ecosystems for IC development, spanning IC design, open market IP integration, wafer fabrication, and assembly/test services. Open-Silicon received the Global Semiconductor Alliance (GSA) award for Most Respected Private Semiconductor Company in 2008 and 2009. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

Logic Back Biasing Solution and Low Power Memories Enable Ultra Low Power Design

MILPITAS and FREMONT, Calif. – February 17, 2010: Open-Silicon, Inc., a leading ASIC design and semiconductor manufacturing company, and Virage Logic (NASDAQ: VIRL), the semiconductor industry’s trusted IP partner, today announced a partnership agreement to provide customers with comprehensive design solutions including access to Virage Logic’s extensive Physical and advanced Interface intellectual property (IP) portfolio. In particular, as more and more customers develop energy efficient devices, Virage Logic’s low power IP combined with Open-Silicon’s lower power design technology enable the development of significantly lower power silicon.

“This partnership underscores our continued commitment to meet our customers’ needs for lower power, managed variability, and faster time-to-market,” said Dr. Naveed Sherwani, CEO and president of Open-Silicon. “We selected Virage Logic as our trusted IP partner because of their proven track record in providing a broad portfolio of highly differentiated IP. This offering, paired with Open-Silicon’s OpenMODEL™ proven integration capability, allows customers to achieve very high levels of performance while reducing overall system power.”

The partnership presents a well-aligned technology offering. Virage Logic, a leader in low power semiconductor IP technology, uses several advanced power management features within the SiWare™ Memory compilers and SiWare™ Logic libraries that enable customers to dramatically reduce leakage current while maximizing performance. Open-Silicon’s VariMAX back biasing technology similarly works with Virage Logic’s tapless SiWare Logic standard cell libraries to reduce leakage for the IC’s logic. By changing the amount of bias used on individual chips, VariMAX effectively tunes the silicon for optimum power and thereby boosts production yields. This latest collaboration builds on a recently announced co-developed test chip with working silicon running at 1.1GHz that was achieved using Open-Silicon’s patented CoreMAX™ performance enhancement technology and Virage Logic’s advanced SiWare Memory compilers.

“As power management and efficiency are becoming increasingly critical in a multiplicity of products and technologies, our collaboration with Open-Silicon underscores how we are working with our design ecosystem partners to help SoC designers address these challenges,” said Dr. Alex Shubat, president and CEO of Virage Logic. “Open-Silicon’s MAX Technologies working in conjunction with Virage Logic’s extensive semiconductor IP portfolio enables our mutual customers to address a broad range of SoC design requirements.”

About Virage Logic's SiWare Memory and SiWare Logic Products

The SiWare product line, first introduced in October 2007 for the 65-nanometer(nm) process and now in use by more than 20 customers on the 40nm process, has been proven to address the increasingly complex design requirements that are placed on physical IP at advanced processes. The power-optimized memories for advanced processes minimize both static and dynamic power consumption and provide optimal yields. SiWare High-Density memory compilers are optimized to generate memories with the absolute minimum area. SiWare High-Speed memory compilers are designed to help designers achieve the most aggressive critical path requirements. Compile-time options for process threshold variants, power saving modes, read and write margin extensions, ultra-low voltage operation, and innovative design for at-speed test enable SoC designers to configure optimal solutions for their specific design requirements.

All SiWare Memory compilers are fully supported by Virage Logic's STAR™ Memory System, the company's flagship embedded memory test and repair system that may be used with Virage Logic memories as well as with other commercially available or internally developed memories. For repair purposes, the STAR Memory System deploys foundry-developed eFuse for repair signature storage. The STAR Memory System employs test algorithms tailored for advanced processes for higher product reliability and accelerated time-to-yield.

The SiWare Logic product line includes yield-optimized standard cells for a wide variety of design applications at 40nm with multiple threshold process variants. SiWare Logic libraries offer three separate architectures to optimize circuits for Ultra-High-Density, High-Speed, or general use. SiWare Logic Ultra-Low-Power extension libraries also provide designers with the most advanced power management capabilities.

About Virage Logic

Virage Logic is a leading provider of semiconductor intellectual property (IP) for the design of complex integrated circuits. The company's highly differentiated product portfolio includes processor solutions, interface IP solutions, embedded SRAMs and NVMs, embedded test and yield optimization solutions, logic libraries, and memory development software. As the industry's trusted semiconductor IP partner, more than 400 foundry, IDM and fabless customers rely on Virage Logic to achieve higher performance, lower power, higher density and optimal yield, as well as shorten time-to-market and time-to-volume. For further information, visit http://www.viragelogic.com.

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on SoC realization for traditional ASIC, develop-to-spec, and derivative ICs. Open-Silicon’s OpenModel brings together Open-Silicon’s engineering technology and high-quality manufacturing services with one of the broadest partner ecosystems for IC development, spanning IC design, open market IP integration, wafer fabrication, and assembly/test services. Open-Silicon received the Global Semiconductor Alliance (GSA) award for Most Respected Private Semiconductor Company in 2008 and 2009. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

All trademarks are the property of their respective owners and are protected herein.

Demonstrates its Continued Efforts to Create Low-Power ASIC and SoC Designs

MILPITAS, Calif. – January 26, 2010: Open-Silicon, Inc., a leading ASIC design and semiconductor manufacturing company, announced today that it has joined the Power Forward Initiative (PFI), an industry effort sponsored by Cadence Design Systems (NASDAQ: CDNS) with the goal of enabling the design and production of more power-efficient electronic devices.

“Our customers have become very sensitive to power efficiency. Many mainstream designs, which were not traditionally power sensitive, are now paying close attention to power consumption due to exponential growth in leakage power and higher dynamic power from increasing levels of integration and performance,” said Dr. Naveed Sherwani, CEO and president of Open-Silicon. “We have demonstrated our commitment to building high-performance, low-power designs for our customers using our PowerMAX™ Technology. Now our move to join PFI reinforces our commitment to meet our customers’ needs.”

Open-Silicon’s MAX Technologies offer customers power saving advantages like back biasing, transistor transformations, and power recovery. The combination of the best low-power EDA design flows with Open-Silicon’s unique technologies allows building the best possible custom silicon. The company recently announced that Solarflare has successfully used PowerMAX in its second-generation SFC9020 Ethernet Controller with integrated 10Gb Ethernet PHY, which has been sampling to Tier1 server OEMs. This is the third generation of Solarflare silicon built by Open-Silicon, and the second designed using Open-Silicon’s PowerMAX technology to optimize the silicon for low power.

“The addition of Open-Silicon to the Power Forward Initiative demonstrates the ongoing strong industry support behind our mission,” said Neil Hand, director of low power solutions at Cadence Design Systems. “Open-Silicon’s extensive and varied design and manufacturing experience provides a unique perspective to the group and we look forward to the addition of the company.”

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on SoC realization for traditional ASIC, develop-to-spec, and derivative ICs. Open-Silicon’s OpenModel brings together Open-Silicon’s engineering technology and high-quality manufacturing services with one of the broadest partner ecosystems for IC development, spanning IC design, open market IP integration, wafer fabrication, and assembly/test services. Open-Silicon received the Global Semiconductor Alliance (GSA) award for Most Respected Private Semiconductor Company in 2008 and 2009. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

About Power Forward Initiative

The Power Forward Initiative, which has more than 40 member companies, is an industry initiative sponsored by Cadence Design Systems which has the goal of enabling the design and production of more power-efficient electronic devices. The initiative includes companies representing a broad cross section of the design chain including system, semiconductor, foundry, IP, EDA, ASIC and design services companies. CPF was contributed by Cadence to the Si2 Low Power Coalition in December 2006; CPF is a widely-deployed low-power intent standard in the industry and available from Si2. The Initiative has also published A Practical Guide to Low-Power Design – User experience with CPF which is aimed at educating the broad design marketplace in utilizing advanced low-power design techniques. The Guide is available free of charge at www.powerforward.org.

Open-Silicon Expands One of the Broadest Partner Ecosystems for IC Development

MILPITAS, Calif. – January 12, 2010: Open-Silicon, Inc., a leading SoC design and semiconductor manufacturing company, announced today the acquisition of Silicon Logic Engineering (SLE) to enhance the company’s derivative IC design capabilities. The SLE team, based in Eau Claire, Wis., joined Open-Silicon effective December 7, 2009.

As part of Open-Silicon, SLE will increase the front-end capabilities at the company for designing derivative ICs, which are increasingly in demand as semiconductor companies look to maximize the returns on their initial platform IC investments. Previously Open-Silicon announced successful completion of an NXP Semiconductor product development which went from spec to production, including software, within 13 months. To build the best fully custom ICs and derivatives, specific technology and market design knowledge is needed. Open-Silicon will continue using an existing network of industry-leading design services partners, combined with the SLE team, to offer customers the best fitting design solutions on the market.

SLE was founded in 1996 from senior engineers formerly with supercomputer company Cray Research. Over the past 13 years, Silicon Logic Engineering has provided the ASIC industry with architecture, RTL design, design verification, and physical design services and grown to a respected industry icon with a reputation as the premier design center for highly complex designs. With an average of more than 20 years of engineering experience on designs up to 50M+ gates, SLE’s team brings extensive technical knowledge of the computing, networking, telecommunications and military/aerospace industries.

“Companies today are looking for ways to leverage their engineering investments. The SLE team, along with the existing Open-Silicon team, provides the capability to build the derivative IC designs our customers seek,” said Dr. Naveed Sherwani, CEO and president of Open-Silicon. “With this merger, Open-Silicon has created one of the broadest partner ecosystems for IC development which includes multiple foundry, IP, and assembly/test partners to provide the best possible technologies for each IC.”

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on SoC realization for traditional ASIC, develop-to-spec, and derivative ICs. Open-Silicon’s OpenModel™ brings together Open-Silicon’s engineering technology and high-quality manufacturing services with one of the broadest partner ecosystems for IC development, spanning IC design, open market IP integration, wafer fabrication, and assembly/test services. Open-Silicon received the Global Semiconductor Alliance (GSA) award for Most Respected Private Semiconductor Company in 2008 and 2009. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

MILPITAS, Calif. – December 15, 2009: Open-Silicon, Inc., a leading ASIC design and semiconductor manufacturing company, announced today that for the second year in a row it has won the Global Semiconductor Alliance (GSA) award for the industry's "Most Respected Private Semiconductor Company."

The GSA presents this award annually to the private company most respected in terms of technology, vision and future opportunity. The demand for Open-Silicon’s develop-to-spec IC services and utilization of its MAX Technologies has put the company at the forefront of IC design. Also, teaming with industry leading IP and design services vendors has enhanced Open-Silicon’s offering, making it one of the most flexible industry partners for IC development.

“To receive one of the most prestigious awards given in our industry is a great honour and a tribute to our open market development model, the OpenMODEL™,” said Dr. Naveed Sherwani, Open-Silicon president and CEO. “We have assembled a world-class team of vendors, partners and customers that allow us to predictably and reliably deliver customized semiconductor products. As we move forward we intend to build on what has helped us achieve so much and increase our offering for our customers.”

Only two other companies have received this award more than once, NVIDIA and Cavium Networks, both of which are now public companies. The award process consists of nomination by a GSA committee of industry experts and then final selection by the semiconductor community, including semiconductor financial and industry analysts and suppliers.

GSA announced on December 14, 2009, all of the GSA Award winners. To view the complete press release visit http://www.gsaglobal.org/news/article.asp?article=2009/1214.

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on setting new standards for predictable, reliable and flexible custom IC development. Open-Silicon provides leading-edge SoC and ASIC design, proven open market IP integration and high-quality silicon manufacturing services to customers worldwide. Through the MAX Technologies, Open-Silicon continues to introduce technology advantages in the areas of low-power design, high-performance processor implementation, variability management, and low-cost test that help customers increase their market success. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

MILPITAS, Calif. - November 24, 2009: Open-Silicon, Inc., a leading ASIC design and semiconductor manufacturing company, announced today that due to the increasing international demand for open market IC solutions, the company has teamed with PrinSipa as Open-Silicon’s representative for the UK and Ireland. The engagement with PrinSipa will further extend the successes Open-Silicon has already seen in Europe, providing leading edge technology solutions to customers seeking high quality ASIC design support as well as develop-to-spec IC services.

Open-Silicon’s OpenMODEL™ will be a key offering for PrinSipa to extend to its customers. The OpenMODEL enables customers to utilize the best technology available on the open market. Combining the foundry that is the best match for the product type, with the world's best IP, allows designers to build the best possible custom silicon. In addition, Open-Silicon has seen a growing demand for its PowerMAX™ Technology, which is used to optimize designs for low-power, especially in the markets that PrinSipa serves, such as consumer, storage, telecommunications, and industrial.

“PrinSipa has proven market and customer knowledge and their commitment to the support of the SoC design-in process made PrinSipa the ideal representative partner. We look forward to leveraging PrinSipa’s local presence to continue the growth and success we have experienced in Europe,” said Dave Krishna, VP of worldwide sales at Open-Silicon.

David Clark, Managing Partner at PrinSipa added, “Open-Silicon’s outstanding product offering, together with its professional and open culture, make it an ideal PrinSipa partner. Open-Silicon is a principal who is sure to be at the heart of our representational strategy and together, our mission is to evolve Open-Silicon into an indispensable SoC and ASIC technology partner to the UK and Ireland customer base.”

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on setting new standards for predictable, reliable and flexible custom IC development. Open-Silicon provides leading-edge SoC and ASIC design, proven open market IP integration and high-quality silicon manufacturing services to customers worldwide. Through the MAX Technologies, Open-Silicon continues to introduce technology advantages in the areas of low-power design, high-performance processor implementation, variability management, and low-cost test that help customers increase their market success. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

About PrinSipa

PrinSipa is a semiconductor manufacturer’s representative covering the UK and Ireland offering advanced SoC manufacturers advanced sales development abilities. PrinSipa’s focus is on key OEM customers in the Storage, Consumer, Telecom and Industrial markets. Whether operating in close cooperation with the principal’s established OEM sales and distributor teams, or operating as a delegated direct sales force, PrinSipa has the market knowledge, sales drive and technical expertise to deliver quality added value to its principals and OEM customers alike. www.prinsipa.com

Develop-to-spec ICs increase Open-Silicon’s portfolio

MILPITAS, Calif. - November 17, 2009: Open-Silicon, Inc., a leading ASIC design and semiconductor manufacturing company, announced today that it has reached the 150th design win milestone. The company has experienced an increasing demand for its develop-to-spec IC services over the past two years, and seen public companies increasingly embrace the company’s OpenMODEL™. In addition, Open-Silicon has opened an office in Japan to better address the company’s growing global demand.

Open-Silicon’s recent design wins have come from customers worldwide, including Canada, China, Europe, Israel, Japan, Singapore, and the United States. The company’s strong technology leadership with its MAX Technologies product line and innovative OpenMODEL has earned Open-Silicon global design wins across a wide range of industry segments—from wireless and mobile to storage and networking, security, and telecommunications. Also, increasingly semiconductor companies are contracting with Open-Silicon to take a specification and develop complete semiconductor products. For example, earlier this year Open-Silicon announced that the company successfully took NXP Semiconductor’s media processor from specification through production, including software, within 13 months.

Open-Silicon attributes much of its success to the OpenMODEL, the semiconductor industry's first spec-to-silicon SoC development solution based on a revolutionary business model that provides a seamless, low-cost, and low-risk alternative to traditional models for complex semiconductor design and development. The OpenMODEL offers the right choice of foundry, IP, package and test, that fits perfectly the need for each ASIC, based on performance, power, cost, schedule, application and market.

"The advent of Open-Silicon’s 150th design win is a true testament to our ability to deliver the most cost-effective, predictable and reliable custom SoC solutions,” said Dave Krishna, vice president worldwide sales at Open-Silicon. "The fact that customers of all sizes, market segments and geographies are seeking this flexibility validates that we have the right processes in place and have built the right relationships to ensure success for a large variety of customers.”

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on setting new standards for predictable, reliable and flexible custom IC development. Open-Silicon provides leading-edge SoC and ASIC design, proven open market IP integration and high-quality silicon manufacturing services to customers worldwide. Through the MAX Technologies, Open-Silicon continues to introduce technology advantages in the areas of low-power design, high-performance processor implementation, variability management, and low-cost test that help customers increase their market success. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

65nm Silicon Runs 1.1GHz Today; 40nm Target to Exceed 2.5GHz

MILPITAS, SUNNYVALE and FREMONT, Calif. – October 27, 2009: Open-Silicon, Inc., MIPS Technologies, Inc. (NASDAQ: MIPS), and Virage Logic (NASDAQ: VIRL) today announced the co-development of test chips showcasing the companies’ industry-leading technologies for building high-performance processor-based systems. The companies achieved successful 65 nanometer (nm) silicon testing of a processor test chip at 1.1GHz, making it one of the fastest processors built in a 65nm ASIC. Also, work has begun on a follow-on 40nm device targeting frequencies in excess of 2.5GHz and providing over 5000 DMIPS of performance. Both efforts utilize Open-Silicon’s CoreMAX™ technology as well as the superscalar MIPS32® 74K® processor core, a fully synthesizable processor core widely used in high-end digital consumer devices, set top boxes, and networking solutions.

The 65nm test chip was designed to show how the companies’ technologies can be used to achieve top performance in a standard ASIC implementation. The 74K processor core is complemented with 32KB L1 instruction and data caches, a 512KB L2 cache, and system and memory controller blocks, and was implemented using TSMC’s 65nm GP process with standard 10 track libraries and Virage Logic’s SiWare™ Memory compilers. The companies have working silicon running at 1.1GHz. To achieve this goal, Open-Silicon applied its patented CoreMAX performance enhancement technology to the design. This technology permitted the designers to build several hundred new standard cells targeted specifically at speeding up the design’s critical paths. This, along with the advanced SiWare Memory compilers and a triple Vt process option, allowed final design worst-case timing closure across all corners at 1.1GHz with standard ASIC margins.

“Open-Silicon was proud to work with our partners MIPS Technologies and Virage Logic to demonstrate our performance optimization technology,” stated Dr. Naveed Sherwani, CEO and president of Open-Silicon. “Open-Silicon’s CoreMAX has been used across more than 50 customer designs to gain an extra 10% of performance, giving them a competitive edge in their markets. It is a testament to the Open-Silicon technology to take a blazingly fast MIPS processor, use mainstream TSMC standard cell libraries, and achieve a new level of performance.”

“For more than a decade, Virage Logic’s embedded memories have been the IP of choice for high performance processor implementations,” said Dr. Alex Shubat, CEO and president of Virage Logic. “We are excited to serve as Open-Silicon’s and MIPS Technologies’ trusted IP partner and provide them with silicon-proven high speed memory technology that helps remove system bottlenecks and delivers the highest levels of performance possible.” The 40nm test chip in development is planned to reach silicon in the first quarter of 2010. The performance target is very high; frequencies above 2.5GHz are expected when selected from typical silicon, providing over 5000 DMIPS at top speeds. This test chip will include a floating point version of the 74K processor core, along with L2 cache, and system and memory controller blocks.

“MIPS Technologies has long been a performance leader in the processor IP industry, and we are continuing that tradition with these latest achievements,” said John Bourgoin, CEO and president of MIPS Technologies. “The 74K core is popular as the primary CPU in DTV, IPTV and cable set-top boxes, networking applications and other applications requiring high levels of performance. As we continue to push the performance bar with new technologies and through collaboration with industry leaders like Open-Silicon and Virage Logic, MIPS Technologies’ customers will enjoy the necessary processor headroom to support continued feature enhancement for years to come.”

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on setting new standards for predictable, reliable and flexible custom IC development. Open-Silicon provides leading edge ASIC and SoC design, proven open market IP integration and high quality silicon manufacturing services to customers worldwide. Through the MAX Technologies, Open-Silicon continues to introduce technology advantages in the areas of low power design, high performance processor implementation, variability management, and low cost test that help customers increase their market success. In 2008, Open-Silicon was recognized by the GSA as the Most Respected Private Semiconductor Company. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

About MIPS Technologies, Inc.

MIPS Technologies, Inc. (NASDAQ: MIPS) is a leading provider of industry-standard processor architectures and cores that power some of the world's most popular products for the home entertainment, communications, networking and portable multimedia markets. These include broadband devices from Linksys, DTVs and digital consumer devices from Sony, DVD recordable devices from Pioneer, digital set-top boxes from Motorola, network routers from Cisco, 32-bit microcontrollers from Microchip Technology and laser printers from Hewlett-Packard. Founded in 1998, MIPS Technologies is headquartered in Sunnyvale, California, with offices worldwide. For more information, contact (408) 530-5000 or visit www.mips.com.

About Virage Logic

Virage Logic is a leading provider of both functional and physical semiconductor intellectual property (IP) for the design of complex integrated circuits. The company's highly differentiated product portfolio includes processor centric solutions, interface IP solutions, embedded SRAMs and NVMs, embedded memory test and repair, logic libraries, and memory development software. As the industry's trusted semiconductor IP partner, more than 350 foundry, IDM and fabless customers rely on Virage Logic to achieve higher performance, lower power, higher density and optimal yield, as well as shorten time-to-market and time-to-volume. For further information, visit http://www.viragelogic.com.

CoreMAX is a trademark of Open-Silicon, Inc. MIPS, MIPS32 and 74K are trademarks or registered trademarks in the United States and other countries of MIPS Technologies, Inc. SiWare Memory is a trademark of Virage Logic Corporation. All other trademarks referred to herein are the property of their respective owners.

MILPITAS, CA – October 20, 2009: Open-Silicon, Inc., a leading developer of custom ASICs and SoCs, announced today that Solarflare Communications, the leader in 10 Gigabit Ethernet (10GbE) silicon, is using Open Silicon’s PowerMAX™ technology in its second-generation SFC9020 Ethernet Controller with integrated 10Gb Ethernet PHY, which has been sampling to Tier1 server OEMs. This is the third generation of Solarflare silicon built by Open-Silicon, and the second designed using Open-Silicon’s PowerMAX technology to optimize the silicon for low power.

Solarflare offers state-of-the-art 10GBASE-T performance with industry-leading low power, achieved by a best-in-class architecture, PHY integration, and Open-Silicon’s PowerMAXTM technology. The SFC9000 family can be used in most 10GbE applications, including LAN-on-motherboard, embedded adapters, blade mezzanine cards, and PCIe adapters. Solarflare’s product includes integrated SR-IOV, PCIe 2.0, and an integrated 10Gb SerDes requiring advanced 65nm design methodology to optimize the physical design for low power.

Open-Silicon’s PowerMAX technology offers low-power design techniques like multi-voltage, multi-channel length, and multi-Vt design. In addition, Open-Silicon offers custom techniques like back biasing, transistor transformations, and power recovery. The combination of the best low-power EDA design flows with Open-Silicon’s unique technologies allows building the best possible custom silicon.

“Solarflare’s 10Gb Ethernet products address the industry need for network convergence by offering support for networking, iSCSI, and FCoE traffic through a common portal,” said Danny Shamlou, senior vice president engineering of Solarflare. “Equally important is our focus on power efficiency. By partnering with Open-Silicon, we were able to build the lowest power solution in the industry, consuming less than half the power of the leading competitors’ products.”

“Open-Silicon offers a wide range of best-in-class engineering solutions to meet our customers’ various needs,” stated Dr. Naveed Sherwani, CEO and president of Open-Silicon. “Working with Solarflare has been a great experience and we are pleased that we have enabled them to set a new standard for low-power Ethernet solutions.”

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on setting new standards for predictable, reliable and flexible custom IC development. Open-Silicon provides leading-edge SoC design, proven open market IP integration and high-quality silicon manufacturing services to customers worldwide. Through the MAX Technologies, Open-Silicon continues to introduce technology advantages in the areas of low-power design, high-performance processor implementation, variability management, and low-cost test that help customers increase their market success. In 2008, Open-Silicon was recognized by the GSA as the Most Respected Private Semiconductor Company. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

About Solarflare Communications, Inc.

Solarflare Communications is a semiconductor company delivering the next level of high-performance 10 Gigabit Ethernet (10GbE). As the leading provider of standards-compliant 10GbE silicon, Solarflare’s robust and power-efficient solutions are cost effective and easy to deploy. Ready for primetime, Solarflare 10GbEmakes possible next-generation applications such cloud computing, server virtualization, network convergence and low-latency networking (with Open Onload™) for market data applications. The privately held company is headquartered in Irvine, California, with a development center in Cambridge, UK, and has announced relationships with Accton, Citrix, CommScope, Delta Networks Inc., Panduit, SMC Networks and VMware.

MILPITAS, CA – June 25, 2009: Open-Silicon, Inc., a leading open market semiconductor manufacturer and provider of spec-to-silicon System-on-Chip (SoC) design services, today announced that the company was recently certified for the ISO 9001:2008 standard as part of their overall strategic plan for implementing best business practices and procedures. ISO 9000 is a family of standards for Quality Management Systems that was updated to ISO 9001:2008 on November 15, 2008.

“Quality is the foundation of our business. By certifying to the newest version of the ISO standards, we are confident that our processes are of the highest quality and that the continual improvement process to our systems is automatically implemented,” said Dr. Shafy Eltoukhy, vice president of manufacturing operations. “This adherence to quality translates to excellence in our SoC services and products that deliver on our promise of reduced design and development times, reduced costs and improved product reliability and performance.”

The International Organization for Standards (ISO) is the largest standards organization in the world, with a network of standards institutes from 159 countries. The ISO 9001 is a set of procedures covering all key processes within a business and ensures that these processes are efficient, effective and are monitored consistently allowing the company to continuously improve on its processes.

About Open-Silicon

Open-Silicon, Inc. is a leading semiconductor company focused on setting new standards for predictable, reliable and flexible custom IC development. Open-Silicon provides leading edge SoC design, proven open market IP integration and high quality silicon manufacturing services to customers worldwide. Through the MAX Technologies, Open-Silicon continues to introduce technology advantages in the areas of low power design, high performance processor implementation, variability management, and low cost test that help customers increase their market success. In 2008, Open-Silicon was recognized by the GSA as the Most Respected Private Semiconductor Company. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

MILPITAS, CA —May 12, 2009: Open-Silicon, Inc., the leading open market semiconductor manufacturer and provider of spec-to-silicon ASIC design services, today announced successful completion of the software development phase of a custom ASIC device developed for NXP Semiconductors. Open-Silicon took the design from specification through production, including software, within 13 months.

The NXP device, a media processor SoC implemented in a 90nm low-power process, employed NXP IP and both Open-Silicon and NXP-specific design methodology. The Open-Silicon development team started with an architectural specification of the chip and designed verification boards and driver software, along with the hardware evaluation platform. The complex SoC was implemented through the Open-Silicon ASIC design methodology, a time-proven, repeatable process based on an established scientific approach that ensures cost-effective ASICs with on-time schedules and successful “first silicon” results.

“Our proven processes build in predictability and reliability, allowing us to successfully create this complex design from RTL through software and board development to production in record time,” said Taher Madraswala, Sr. Director, ASIC program management. “Additionally, our project management infrastructure, which includes ASICView™ software, allowed all hardware and software team members to view the project in real time and coordinate all deliverables on this complex project.”

“We selected Open-Silicon to complete this important project because of the proven Open-Silicon design and production methodology,” said Marcel Walgering, general manager of Media Processing, NXP Semiconductors. “Open-Silicon has both the technical expertise and the processes in place to successfully deliver repeatable results with very fast design cycles, allowing NXP to address market demand for this product with a fast time to market.”

About Open-Silicon

Open-Silicon, Inc. is a fabless ASIC company that was founded to set new standards for the predictability and reliability of ASICs and enable customers to differentiate their products through affordable custom silicon. Open-Silicon provides leading edge ASIC design, open market IP integration, and high quality silicon manufacturing services to customers worldwide. Through the “Science of ASICs” initiative Open-Silicon continues to introduce technology advantages that help customers increase their market success. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

May 6, 2009 - BANGALORE, INDIA: Open-Silicon, Inc., the leading open market semiconductor manufacturer and provider of spec-to-silicon ASIC design services, today announced the hiring of Shrikrishna Gokhale as COO of the company and managing director for its rapidly expanding India operations. He will be taking up this assignment by mid-May.

"Our business continues to grow at a significant pace which supports our growth plans for our India operation," said Dr. Naveed Sherwani, CEO and president of Open-Silicon. "Mr. Gokhale was selected because of his experience in driving and managing fast business growth through multi-national teams while remaining focused on customer support. His technical experience and semiconductor product development including VLSI design, device architecture and embedded software, combined with specific strengths in key markets such as communications and consumer electronics, will help us further establish our leadership in complex ASIC development."

Gokhale has over 28 years' experience in business management and technology development with Sasken, Philips and others. He has successfully managed multi-site teams of 600+ professionals spread across offshore, onsite and near-shore locations. In his previous positions, he handled various responsibilities including product development, business growth, resource planning and delivery management.

As COO and managing director, Gokhale will oversee Open-Silicon's day-to-day operations and will report directly to Dr. Sherwani.

About Open-Silicon, Inc.

Open-Silicon, Inc. is a fabless ASIC company that was founded to set new standards for the predictability and reliability of ASICs and enable customers to differentiate their products through affordable custom silicon. Open-Silicon provides leading edge ASIC design, open market IP integration, and high quality silicon manufacturing services to customers worldwide. Through the "Science of ASICs" initiative Open-Silicon continues to introduce technology advantages that help customers increase their market success. For more information, visit Open-Silicon's website at www.open-silicon.com or call 408-240-5700.

MILPITAS, CA - May 1, 2009: Open-Silicon, Inc., the leading open market semiconductor manufacturer and provider of spec-to-silicon ASIC design services, today announced a new MAX technology focused on test engineering excellence. The patent pending TestMAX™ technology addresses test time reduction to lower device cost.

Design gate counts continue to grow exponentially, increasing both wafer probe and final test costs. Traditional scan testing frequencies are limited by the power dissipation in the device under test. By profiling the scan vectors for power dissipation, Open-Silicon is able to select those tests with lower thermal impact and power mesh currents and greatly increase their frequency. The net result is a significant reduction in test time, and therefore device cost.

“The ASIC industry often focuses on supply chain for cost reduction,” said Dr. Naveed Sherwani, CEO and president of Open-Silicon. “Open-Silicon’s MAX technologies are focused on making the best possible custom silicon, including design for lowest cost. Last year’s introduction of VariMAX™ enabled the highest manufacturing yields by managing process variability, and now TestMAX complements that by lowering device test costs.”

TestMAX’s scan shift frequency scaling technology won the SNUG best paper award in 2007.

About Open-Silicon

Open-Silicon, Inc. is a fabless ASIC company that was founded to set new standards for the predictability and reliability of ASICs and enable customers to differentiate their products through affordable custom silicon. Open-Silicon provides leading edge ASIC design, open market IP integration, and high quality silicon manufacturing services to customers worldwide. Through the “Science of ASICs” initiative Open-Silicon continues to introduce technology advantages that help customers increase their market success. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

MILPITAS, CA - April 29, 2009: Open-Silicon, Inc., the leading open market semiconductor manufacturer and provider of spec-to-silicon ASIC design services, today announced that the Company has achieved a milestone by shipping more than 40 million units.  This accomplishment was achieved in only the company’s sixth year of business, and fourth year of production shipments. Customers include Fortune 500 companies within the telecommunications, consumer, storage, and computing markets.

“Our ability to earn this high-volume business in high-growth applications is indicative of the success of our flexible ASIC model and our attention to quality,” said Dr. Shafy Eltoukhy, vice president of manufacturing operations. “By bringing together the highest level of customer service and support with MAX technologies and the OpenModel™, we develop the best possible silicon at any complexity level on time and cost effectively.”

The 40 million units represent a range of designs up to 30M gates with complex cores and multiple processors produced on processes from 0.25µm to 65nm from four different foundries. World foundry leader, TSMC, has produced the largest percentage of chips for Open-Silicon customers.

About Open-Silicon

Open-Silicon, Inc. is a fabless ASIC company that was founded to set new standards for the predictability and reliability of ASICs and enable customers to differentiate their products through affordable custom silicon. Open-Silicon provides leading edge ASIC design, open market IP integration, and high quality silicon manufacturing services to customers worldwide. Through the “Science of ASICs” initiative Open-Silicon continues to introduce technology advantages that help customers increase their market success. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

MILPITAS, Calif.-January 28, 2009: Open-Silicon, Inc., the leading open market semiconductor manufacturer and provider of spec-to-silicon ASIC design services, today announced successful completion of two complex ASIC designs. The designs, which included large numbers of integrated high-speed serializer/deserializer (SerDes) cores, demonstrate Open-Silicon's high-end digital IC design capabilities and ability to integrate complex open market IP. While Open-Silicon has worked on a total of 30 ASICs with SerDes to date, the high lane count of these two recently completed devices made them particularly challenging in the areas of timing closure, package design, test, and physical design for signal integrity.

The first chip, which is not yet announced, integrated over 50 SerDes for a networking application. An additional challenge was imposed by the addition of high speed DDR2 interfaces. To handle all the high-speed IO requirements this chip was packaged in a custom HFCBGA package.

The second of the chips is a Parallel Graphics Unit for gaming and computing designed with LucidLogix Technologies. This ASIC serves as a scalable graphics component connecting a main computer processor to multiple GPUs. A 12-quad 48-channel 2.5Gbps PCIe SerDes network is used to divide graphics processing work among several graphical processing units (GPUs). On this device the PCI Express lanes were spread evenly on all four sides of the die to facilitate use of low-cost wirebond packaging. As a single reference clock feeds all 48 lanes, a novel clock buffer ring was built outside the chip's bond pads to isolate the clock from on-chip noise. Due to the high numbers of SerDes lanes, both designs required careful attention to:

1. Co-design of custom package with die physical design
2. Physical design taking into account the macro placements and signal interactions at very high speeds
3. Extensive SPICE level analysis of critical paths to analyze timing and cross-talk for the large number of SerDes lanes
4. Careful design of power sources to bring power to the macros
5. Verification early in the design phase that the SerDes DFT structures and Automated Test Equipment (ATE) will be able to provide complete and accurate test for production

"High-end 3D graphics processing depends on silicon solutions that require a high degree of design expertise," said Offir Remez, President and Vice President of Business Development for Lucid Information Technologies. "The Open-Silicon design team tackled our tough chip requirements and met our specifications."

About Open-Silicon

Open-Silicon, Inc. is a fabless ASIC company that was founded to set new standards for the predictability and reliability of ASICs and enable customers to differentiate their products through affordable custom silicon. Open-Silicon provides leading edge ASIC design, open market IP integration, and high quality silicon manufacturing services to customers worldwide. Through the "Science of ASICs" initiative Open-Silicon continues to introduce technology advantages that help customers increase their market success. For more information, visit Open-Silicon's website at www.open-silicon.com or call 408-240-5700.

About Lucid

LucidLogix Technologies is reinventing multi-core graphics with its HYDRA real-time distributed processing engine that will exponentially improve visual computing for both business and gaming applications. Lucid is a fabless SoC provider headquartered in Kfar Netter, Israel. For more information, visit www.lucidlogix.com.

MILPITAS, Calif.-January 13, 2009 : Open-Silicon, Inc., the leading open market semiconductor manufacturer and provider of spec-to-silicon ASIC design services, today announced a MAX licensing agreement with Brite Semiconductor, an ASIC company based in Shanghai.

Open-Silicon's MAX technology, announced in November of 2008, addresses design issues common to the 65nm and 40nm process nodes. Depending on customer needs, Brite Semiconductor's Shanghai design center will implement the PowerMAX™, CoreMAX™, and VariMAX™ technologies to build customized silicon with increased performance, managed process variability and lower power.

"The new MAX technology provides tremendous power and performance optimization advantages for our customers' products, regardless of the complexity of their designs," said Charlie Zhi, CEO of Brite Semiconductor. "Design companies in China are moving aggressively to leading-edge technologies. No other ASIC company will be able to offer these advanced design benefits to their China-based customers."

"MAX has been tremendously successful in allowing customers to build the best possible, fully custom silicon for customers' designs or products in smaller process geometries," said Scott Houghton, VP marketing and business development, Open-Silicon. "Brite will be able to enhance its customers' products by taking advantage of the ASIC industry's only transistor-level optimization flow and techniques like adaptive back biasing, which are new to the ASIC space."

About MAX Technology

CoreMAX was created to build the fastest processor cores in the ASIC world. The CoreMAX technology uses over two million lines of C++ software and several patented techniques to create new cells on-the-fly that are optimized at the transistor level for maximum performance. VariMAX addresses increasing process variability through use of a back biasing design approach where the bulk transistor node voltage is controlled so that fast, leaky parts are reined in by adaptive calibration of the silicon. PowerMAX enables design for the lowest possible power. PowerMAX adds to existing physical design techniques with four new technologies: transistor level transformations, back biasing, power recovery, and custom leakage signoff.

About Open-Silicon

Open-Silicon, Inc. provides leading edge ASIC design, open market IP integration, and high quality silicon manufacturing services to customers worldwide. Open-Silicon was founded to set new standards for the predictability and reliability of ASICs and enable customers to differentiate their products through affordable custom silicon. Through the "Science of ASICs" initiative Open-Silicon continues to introduce technology advantages that help customers increase their market success. For more information, visit Open-Silicon's website at www.open-silicon.com or call 408-240-5700.

About Brite Semiconductor

Brite Semiconductor Corporation is a fabless ASIC company headquartered in Shanghai. Brite Semiconductor uses proven design flows and methodologies and advanced design capabilities to provide end-to-end custom ASIC solutions including a complete turnkey service. This engineering strength is partnered with a proven business model that provides a seamless, cost effective, and low risk solution for complex ASIC design and development. For more information, please visit www.britesemi.com.

MILPITAS, Calif.-December 15, 2008: Open-Silicon, Inc., the leading open market semiconductor manufacturer and provider of spec-to-silicon ASIC design services, today announced it has won the Global Semiconductor Alliance (GSA) award for the industry's "Most Respected Private Semiconductor Company."

The GSA presents this award annually to the private company most respected in terms of products, vision and future opportunity. Recent previous winners of this award include NVIDIA, Marvell and Atheros Communications, among others. The award process consists of nomination by a GSA committee of industry experts and then final selection by the semiconductor community, including semiconductor financial and industry analysts and suppliers.

"We are honored that our peers have recognized our leadership and our commitment to product excellence now and in the future," said Naveed Sherwani, Open-Silicon president and CEO. "We attribute our success to our business model, our people, our relationships with customers and our ability to deliver on our strategy to bring cost-effectiveness, predictability and reliability back to the ASIC market."

"We are pleased to present Open-Silicon, Inc. with the Most Respected Private Semiconductor Company Award for their hard work and innovation," said Jodi Shelton, co-founder and executive director of GSA. "It is a great honor to receive this recognition from your peers in the industry."

About Open-Silicon

Open-Silicon, Inc. is a fabless ASIC company that was founded to set new standards for the predictability and reliability of ASICs and enable customers to differentiate their products through affordable custom silicon. Open-Silicon provides leading edge ASIC design, open market IP integration, and high quality silicon manufacturing services to customers worldwide. Through the "Science of ASICs" initiative Open-Silicon continues to introduce technology advantages that help customers increase their market success. For more information, visit Open-Silicon's website at www.open-silicon.com or call 408-240-5700.

MILPITAS, CA - November 12, 2008: Open-Silicon, Inc., the leading open market semiconductor manufacturer and provider of spec-to-silicon ASIC design services, today announced the introduction of three new MAX technologies to address design issues common to the 65nm and 40nm process nodes. Depending on each customer's needs Open-Silicon will use the PowerMAX™, CoreMAX™, and VariMAX™ technologies to build better custom silicon by designing in lower power, increased performance and managed process variability.

"The new MAX technology provides tremendous power and performance optimization advantages to our customers' products, regardless of the complexity of their designs," said Dr. Satya Gupta, VP engineering and co-founder, Open-Silicon. "By combining the ASIC industry's only transistor-level optimization flow with techniques like back biasing, which are new to the ASIC space, Open-Silicon can build the best possible fully custom silicon in smaller process geometries."

About MAX Technology

CoreMAX was created to build the fastest processor cores in the ASIC world. The CoreMAX technology comes out of the Open-Silicon acquisition of Zenasis Technologies in 2007 and uses over two million lines of C++ software and several patented techniques to move beyond the limitations of traditional library-based ASIC design. Built-in CoreMAX functions include design Boolean analysis and optimization, static timing, cell placement, route estimation, and simultaneous optimization at the logical, physical, and transistor levels. Based on the needs of each critical path in the design, CoreMAX may change cells, move cells, or even create new cells on-the-fly, performing a library-compatible layout for each new cell and characterizing these cells for use throughout the EDA environment. The new cells offer unique drive strengths and functionality that enable maximum device performance.

VariMAX addresses increasing process variability. Traditional approaches to variation management involve increased design margins and a large number of extraction and analysis corners. These approaches struggle in technologies like 65nm and 40nm where performance and leakage vary widely across a population of otherwise good devices. In order to manage this, Open-Silicon has implemented a back biasing design approach where the bulk transistor node voltage is controlled so that fast, leaky parts are reined in by adaptive calibration of the silicon.

PowerMAX enables design for the lowest possible power. Open-Silicon has already completed state-of-the-art 65nm designs using power savings methods like low-power place-and-route, voltage islands, power gating, clock gating, and multi-Vt. PowerMAX adds to this foundation with four new technologies: transistor level transformations, back biasing, power recovery, and custom leakage signoff. PowerMAX's transistor level optimization creates new standard cells on-the-fly to drive down both dynamic and leakage power. In addition to its variability control value, back biasing can also be employed whenever devices enter standby mode to further throttle back leakage power and prolong battery life. Power recovery operates late in the design phase to find timing paths with extra timing margin and replace cells with either higher Vt or lower drive strength equivalents. Finally, with custom leakage signoff Open-Silicon characterizes cell library leakage throughout the temperature range and then uses the actual design junction temperature for the leakage power calculation. Since the leakage power doubles every 15 degrees C, this is required for accurate power estimation.

All three products are already silicon proven, or, as is the case with back biasing, currently in fab. All products are available for design use today.

About Open-Silicon

Open-Silicon, Inc. is a fabless ASIC company that was founded to set new standards for the predictability and reliability of ASICs and enable customers to differentiate their products through affordable custom silicon. Open-Silicon provides leading edge ASIC design, open market IP integration, and high quality silicon manufacturing services to customers worldwide. Through the "Science of ASICs" initiative Open-Silicon continues to introduce technology advantages that help customers increase their market success. For more information, visit Open-Silicon's website at www.open-silicon.com or call 408-240-5700.

MILPITAS, CA-October 30, 2008: Open-Silicon, Inc., the leading open market semiconductor manufacturer and provider of spec-to-silicon ASIC design services, today announced that the Company posted its strongest quarter to date in Q3 2008. In addition to strong year on year revenue growth of 49%, YTD bookings were up 47% year on year. Also, YTD design wins grew over 60% compared to the same period in 2007. Since being founded in 2003, Open-Silicon has built a customer base of over 80 customers and taped out more than 100 designs.

"Our business and financial achievements are a testament to our business model and our ability to address the needs of our customers," said Dr. Naveed Sherwani, Open-Silicon president and CEO. "We will continue our success by providing our customers with the products and services needed to support their innovative, next generation designs."

"Today's customers benefit from Open-Silicon's low costs and disciplined approach to predictability and reliability," said Colin Baldwin, Open-Silicon director of marketing. "In addition, more and more customers also are finding unique value in our leadership technology in the areas of low power and high performance design."

About Open-Silicon, Inc.

Open-Silicon, Inc. is a fabless ASIC company that was founded to set new standards for the predictability and reliability of ASICs and enable customers to differentiate their products through affordable custom silicon. Open-Silicon provides ASIC design, open market IP integration, and silicon manufacturing services to customers worldwide. Through the "Science of ASICs" initiative Open-Silicon continues to introduce technology advantages that help customers increase their market success. For more information, visit Open-Silicon's website at www.open-silicon.com or call 408-240-5700.

MILPITAS, CA-September 10, 2008: Open-Silicon, Inc., the leading fabless ASIC company providing the most reliable, predictable and cost-effective alternative to traditional chip design and supply chain models, today announced completion of the 100th tapeout. The company, founded in 2003, reached this historic milestone in only the fifth year of operations.

"One hundred tapeouts within five years is a tremendous accomplishment and one that few other ASIC companies have achieved," said Naveed Sherwani, CEO and president. "While we continue to attract new customers and expand into new markets, it's significant to note that many of our customers are taping out their second or even third designs with us. This is a testament to the technical expertise of our design teams, our ability to complete designs on time with first-pass silicon success and our excellent customer service."

"Strong worldwide demand for Open-Silicon's technology in the advanced process nodes, in particular 65nm and 45nm, will drive our continued rapid growth in 2009 and beyond," said Chitra Hariharan, senior director of engineering. "We are aggressively investing in our engineering methodology and technology infrastructure so that customers moving to 45nm will continue to enjoy the same industry-leading predictability and reliability as our current 90nm and 65nm customers."

About Open-Silicon, Inc.

Open-Silicon, Inc. is a fabless ASIC company that was founded to set new standards for the predictability and reliability of ASICs and enable customers to differentiate their products through affordable custom silicon. Through the "Science of ASICs" initiative, Open-Silicon continues to introduce technology advantages that help customers increase their market success. For more information, visit Open-Silicon's website at www.open-silicon.com or call 408-240-5700.