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Samsung
Foundry customers can tap into world-class IP utilizing SAMSUNG's memory leadership, deep sub-micron expertise and low-power focus, as well as offerings from other Common Platform participants including mixed signal/analog, logic and memory.
Package
A Complete Solution
Open-Silicon provides a complete solution, from package selection, through design & development and into high-volume manufacturing. We understand the importance of selecting the proper packaging solution to meet the technical and cost constraints of each design. Our packaging capabilities are necessarily very broad and our experience level very deep to meet the unique needs of each customer to successfully launch their product into any of the following:
- Wafer-level chip scale packages
- Low-cost leadframe packages
- The full range of BGA packages
- High-performance flip chip packages
- Organic and ceramic packaging
- Multi-Chip Packages, including both stacked and side-by-side die configurations
- Signal and power integrity modeling of packages and PCBs
- High-performance interface design, including >10GHz SerDes, high speed DDR2/3, and WiMAX
Working Together
The OpenMODEL™ allows our customers complete visibility and flexibility in designing the optimal package solution. Our package engineers engage very early in the design cycle, in order to collaborate with our customers in evaluating the most optimum package solution based on their specific design and application requirements. We also work closely with the IC physical design engineers to make sure the substrate design will meet the product specifications.
The package engineering role does not end at the substrate design. We provide a preliminary thermal analysis to check the power requirement and final package model parameters. We also work closely with our customers to evaluate any PCB design, manufacturability, environmental and reliability (1st & 2nd Level) requirements and issues. Our close collaboration with our partners enables us to vertically link up all activities in the manufacturing value chain and provide our customers with full access to documents such as bonding diagrams and substrate design documents as well as assembly WIP through our online program management system, ASICVIEW.