Open-Silicon, a system optimized ASIC solutions provider, will be exhibiting at the Embedded World 2017 Nuremberg, Germany between 14 – 16 March 2017 to demonstrate the company’s IoT Gateway SoC Platform, 2.5D SoC demo along with Comprehensive HBM2 IP Sub-System Solution. Visit us at booth 3-641 in exhibition hall 3 for viewing the demos and also learning about company’s other innovative ASIC/SoC solutions.
When and Where:
Booth 3-641 in exhibition hall 3
90471 Nürnberg, Germany
Date & opening times:
14 – 16 March 2017
09:00 – 18:00 (14 and 15 March)
09:00 – 17:00 (16 March)
Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers’ products by innovating at every stage of design – architecture, logic, physical, system, software, IP – and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing and test capabilities. The company has partnered with over 150 companies, ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300+ designs and shipped over 125 million ASICs to date. Privately held, Open-Silicon employs over 250 people in Silicon Valley and around the world.
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Open-Silicon is a trademark and service mark of Open-Silicon, Inc. registered in the United States and other jurisdictions. All other trademarks are the property of their respective holders.