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Open-Silicon to Demonstrate its High Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance Computing and Networking Applications and Showcase its IoT Gateway SoC Reference Design for Smart City Applications at ARM TechCon 2017…

Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at ARM TechCon 2017. The company will demonstrate its comprehensive high bandwidth memory (HBM2) IP subsystem solution for 2.5D ASICs in FinFET technologies. This solution is targeted for high performance computing and networking applications. The company will also showcase its IoT Gateway SoC Reference Design targeted for smart city applications. Open-Silicon will also be launching a book titled, Custom SoCs for IoT: Simplified, written by SemWiki in partnership with Open-Silicon.

  • Comprehensive High Bandwidth Memory (HBM2) IP Subsystem Solution for 2.5D ASICs in FinFET TechnologiesThis solution is now available for 2.5D ASIC design starts and also as licensable Intellectual Property (IP). The IP includes the controller, PHY and custom die-to-die I/O needed to drive the interface between the logic-die and the memory die-stack on the 2.5D interposer. Open-Silicon’s HBM2 IP subsystem is silicon proven on a 2.5D HBM2 ASIC SiP (System-in-Package) platform. The platform is used to demonstrate the high bandwidth data transfer rates of 1.6 Gbps/2Gbps, and interoperability between Open-Silicon’s HBM2 IP subsystem and HBM2 memory die-stack.
  • ARM® Cortex®-A9 Based IoT Gateway SoC Reference Design – This IoT Gateway SoC Reference Design is built for smart city applications, such as smart homes, smart waste management, smart transport, smart traffic, smart parking, smart lighting, smart metering and more. The gateway is a full featured device that supports various types of wireless and wireline connectivity, communicates with IoT edge devices, and connects to the cloud through 3G/LTE/WiFi. Open-Silicon’s smart city IoT system setup is a part of Open-Silicon’s Spec2Chip IoT SoC Platform, which allows IoT gateway custom SoC designs to be evaluated at the system level.
  • Book: Custom SoCs for IoT: Simplified: This is the first comprehensive book to explicitly define and detail the various IoT architectures. It covers the multitude of security factors, the power budgets associated with different IoT applications, and many more technical considerations that dictate the success of a custom IoT SoC platform, including but not limited to implementation methodologies, as well as hardware and software trade-offs. The Spec2Chip offerings outlined in this book extend far beyond IoT cloud, IoT edge and IoT gateway devices. OEMs in other emerging technologies, such as deep learning, artificial intelligence, virtual reality, gaming and autonomous driving cars are benefitting from this Spec2Chip platform approach. Customers in these markets are collaborating with turnkey ASIC solution providers so they can scale back on, or even eliminate, the risks and loopholes of a lengthy chip design flow, and focus specifically on the core hardware differentiation IP and end application software that they bring to their innovation. This book includes a detailed case study of Open-Silicon’s successful Spec2Chip approach to custom design for an IoT gateway SoC, and the considerations involved in architectural trade-offs, system partitioning, hardware/software trade-offs, IC and board design, interfacing to manufacturing, assembly and test, and hardware bring-up of ICs, boards and the final system. You can pick up a free copy at Open-Silicon’s booth or you can also download a free eBook at http://www.open-silicon.com/custom-socs-for-iot-simplified/.

Exhibit
When: October 25-26, 2017 – 10:30 am – 6:30 pm
Where: Booth 918 on Exhibit Floor, Santa Clara convention Center, CA.

About Open-Silicon
Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers’ products by innovating at every stage of design — architecture, logic, physical, system, software and IP — and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing and test capabilities. The company has partnered with over 150 companies ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300+ designs and shipped over 130 million ASICs to date. Privately held, Open-Silicon employs over 250 people in Silicon Valley and around the world.  To learn more, visit www.open-silicon.com

Open-Silicon is a trademark and service mark of Open-Silicon, Inc. registered in the United States and other jurisdictions. All other trademarks are the property of their respective holders.