Edition 12, October 2017     (for previous editions, click here)

    
Open-Silicon's HBM2 (High Bandwidth Memory) IP subsystem is silicon proven on a 2.5D HBM2 ASIC SiP (System-in-Package) platform. The platform is used to demonstrate the high bandwidth data transfer and interoperability between Open-Silicon's HBM2 IP subsystem and HBM2 memory die-stack. Know more... 
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TSMC 2017 Open Innovation Platform® Ecosystem Forum

"High Bandwidth Memory (HBM2) IP Subsystem Silicon Validation and Interoperability with HBM2 Memory Die Stack" Open-Silicon Presentation at TSMC NA 2017 OIP 2017
     
   
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Open-Silicon Exhibited at TSMC 2017 NA OIP Ecosystem Forum, Santa Clara, on September 13, 2017. Company demonstrated its Comprehensive High Bandwidth Memory (HBM2) IP Subsystem Solution for 2.5D ASICs in TSMC 16nm FF+ and also presented a technical paper on topic High Bandwidth Memory (HBM2) IP Subsystem Silicon Validation and Interoperability with HBM2 Memory Die Stack... 
   
                   
About Open-Silicon
   
Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers' products by innovating at every stage of design - architecture, logic, physical, system, software, IP - and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing and test capabilities. The company has partnered with over 150 companies, ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300+ designs and shipped over 130 million ASICs to date. Privately held, Open-Silicon employs over 250 people in Silicon Valley and around the world. 
To learn more, visit: www.open-silicon.com
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