Edition 11, July 2017     (for previous editions, click here)

   
Design for Reliability of High Bandwidth Memory SoCs in Advanced FinFet Process Nodes

   
Published in TSMC Europe 2017 OIP Proceedings
Author: Bhupesh Dasila,
Physical Design Architect, 
Open-Silicon.
   
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About Open-Silicon
   
Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers' products by innovating at every stage of design - architecture, logic, physical, system, software, IP - and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing and test capabilities. The company has partnered with over 150 companies, ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300+ designs and shipped over 130 million ASICs to date. Privately held, Open-Silicon employs over 250 people in Silicon Valley and around the world. 
To learn more, visit: www.open-silicon.com
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