Edition 7, July. 2016     (for previous editions, click here)

Open-Silicon Provides Complete Semiconductor Solutions from Concept to Production

Taher Madraswala,
President and CEO of Open-Silicon
April 19, 2016 Pulse
System and product original equipment
manufacturers (OEMs) could use all the help they can get these days to get their products to market quickly and flawlessly. Consumers are placing significant pressure on OEMs, as the demand for data and processing power exponentially increases in devices they manufacture. The increase in the flow of information from the Internet of Things and connected devices has put additional requirements on the infrastructure
that service providers have to deal with. While OEM design budgets are spread thin, companies like Open-Silicon saw an opportunity to aid in the development of processing power by providing design and development resources at the application-specific integrated circuit (ASIC) level. This model allows customers to architect products that meet the consumer demands and hand them off to a company like Open-Silicon
to take advantage of streamlined chip design
implementation and production process. This
model has resulted in the shipment of over 120 million ASICs to date at Open-Silicon, with no end in sight. EEWeb spoke with Taher Madraswala, CEO of Open-Silicon, about the company's unique platform and the future of ASIC development in the industry...Read on...
  



Open-Silicon Selected for ARM Approved Design Partner Program
Partnership Simplifies Custom SoC Development for Embedded and IoT Markets
...Read on...
  
     
Open-Silicon at DAC 2016. Company presents a technical paper and two posters, and demonstrates its breadth of ASIC solutions..Read on...
   
Open-Silicon Participates in Panel Discussion About Multi-Die IC Design and Manufacturing at IEEE EDPS in Monterey... Read on...
   
Upcoming Events - Q3, 2016:
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Open-Silicon to Showcase Breadth of ASIC Solutions at 2016 Open Innovation Platform® (OIP) Ecosystem Forum, San Jose, CA on September, 22. The company will be demonstrating its IoT ASIC Platform and present other ASIC solutions including HBM Gen2 IP Sub-system Solution in TSMC 16nm FF+, 28Gbps SerDes Evaluation Platform in TSMC 28nm,  HMC 2.0 Memory Controller ASIC IP,  Interlaken IP,  and  2.5D SoC Solution at 2016 TSMC OIP Ecosystem Forum, San Jose, CA on September, 22... Click here for details...
     
Open-Silicon to Showcase Breadth of ASIC Solutions at CDNLive 2016, Bangalore, India on August 9 - 10. Company will also underscore its growing expertise in developing and delivering advanced ASIC solutions through several presentations...Click here for details...
  
Open-Silicon tech. paper on "Pipeline based MBIST area overhead optimization using Star Memory System 4.X." to be published by SNUG India 2016... 
   
Open-Silicon Shows IoT ASIC Platform at 2016 TSMC Tech Symposium, Japan on July 1, 2016... Click here for details...
   
Q2, 2016 Events:
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Open-Silicon Showed its IoT ASIC Platform and HMC 2.0 Memory Controller ASIC IP at the 2016 TSMC Tech Symposium & OIP Ecosystem Forum, Amsterdam, on June 13 - 14, 2016. The company also demonstrated its other ASIC solutions including HBM IP, Interlaken IP, 2.5D SoC Solution etc...Click here for details...
   
Open-Silicon Showed Breadth of ASIC Solutions, Including IoT ASIC Platform at DAC, 2016 Austin, on June 6 - 7 - 8, 2016.
The company also underscored its growing expertise in developing and delivering advanced ASIC solutions through several presentations:
Paper Presentation:
Breaking Through the Memory Wall - HBM Subsystem IP
Poster Presentations:
1. Physical Planning of IO Interface for 3D Stacking of Packaged Devices
2. Die Sizing Bound by Peripheral Bumpbs and IPs
...Click here for details...
   
Open-Silicon to co-hosed Stars of IP 2016 at Austin, Texas  ( June 7, 2016)...Click here for details...
     
Open-Silicon Showed IoT ASIC Platform at The Internet of Things Developers Conference (IoT DevCon) on May 25 - 26, 2016...Click here for details...
   
Open-Silicon Showcased its IoT ASIC Platform and Present Papers at ChipEx, Tel Aviv, Israel, on May 9, 2016. The company also presented on following two topics in the conference:
1. Hardware Enabled Algorithmic Tester for 2.5D HBM Solution
2. Trust Based IoT Security Mechanism for ARM-Based SoC
   
Open-Silicon delivered two Tech Talks and two technical presentations (videos) on "IoT ASIC Platform" and "HBM IP Subsystem Ecosystem"  at IP SoC 2016, in Bangalore on Wednesday, April 6, 2016. The company also demonstrated its IoT ASIC Platform and HMC 2.0 Memory Controller ASIC IP on the exhibit floor...Click here for details...
            
About Open-Silicon
   
Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers' products by innovating at every stage of design - architecture, logic, physical, system, software, and IP - and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing, and test capabilities. The company has partnered with over 150 companies ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300 designs and shipped over 120 million ASICs to date. Privately-held, Open-Silicon employs over 250 people in Silicon Valley and around the world. 
To know more visit: www.open-silicon.com

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