Edition 6, April. 2016     (for previous editions, click here)

Open-Silicon: Hardwired for Success...

Taher Madraswala,
President and CEO of Open-Silicon
April 2016 SiliconIndia
Your Idea. Delivered.

The conference room at the Open-Silicon office in Milpitas, CA is fast transforming into a 'Deliberation Chamber'. A consultation on the nuances of a silicon chip upgrade between the company's design team and the product architects of their IDM client is fast gaining momentum. One of the architects, evidently oblivious to the animated discussion surrounding him, reaches out for a notepad and quietly begins to define the upgrade that will soon be his company's next generation product. Talks levitate to action-the embedded micro-processor needs replacement along with the interface, number of video channels need to double, the audio processing unit needs to be able to handle Dolby surround sound, internal memory size needs to cope with real time video streaming and so on. Within hours, the team has a Gantt chart showing dependencies and timelines of various tasks that that would have to be done to create the final product. Such scenes are played over many times at a company that thrives on transforming Ideas into Products that make a difference in the lives of millions of people worldwide. Read on...
  
   
Upcoming Events - Q2, 2016:
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Open-Silicon to Showcase its IoT ASIC Platform and HMC 2.0 Memory Controller ASIC IP at the 2016 TSMC Tech Symposium & OIP Ecosystem Forum, Amsterdam, on June 13 - 14, 2016. Visit our booth on the exhibit floor to view demos and to learn about company's other ASIC solutions including HBM IP, Interlaken IP, 2.5D SoC Solution etc...Click here for details...

Open-Silicon Shows Breadth of ASIC Solutions, Including IoT ASIC Platform at DAC, 2016 Austin, on June 6 - 7 - 8, 2016.
Copmay will also underscore its growing expertise in developing and delivering advanced ASIC solutions through several presentations:
Paper Presentation:
Breaking Through the Memory Wall - HBM Subsystem IP
Poster Presentations:
1. Physical Planning of IO Interface for 3D Stacking of Packaged Devices
2. Die Sizing Bound by Peripheral Bumpbs and IPs
...Click here for details...

Open-Silicon to Showcase IoT ASIC Platform at The Internet of Things Developers Conference (IoT DevCon) on May 25 - 26, 2016...Click here for details...
  
Open-Silicon will Showcase its IoT ASIC Platform and Present Papers at ChipEx, Tel Aviv, Israel, on May 9, 2016. The copmany will also present on following two topics in the conference:
1. Hardware Enabled Algorithmic Tester for 2.5D HBM Solution
2. Trust Based IoT Security Mechanism for ARM-Based SoC
  
Open-Silicon delivered two Tech Talks and two technical presentations (videos) on "IoT ASIC Platform" and "HBM IP Subsystem Ecosystem"  at IP SoC 2016, in Bangalore on Wednesday, April 6, 2016. The company also demonstrated its IoT ASIC Platform and HMC 2.0 Memory Controller ASIC IP on the exhibit floor...Click here for details...
  
   
Open-Silicon exhibited at the TSMC Tech. Symposium, San Jose, on March 15, 2016 and demonstrated its Industrial IoT ASIC Platform and 28G SerDes Evaluation Platform...Click here for details...

Open-Silicon exhibited at the IoT Summit 2016, on March 17 - 18, in Santa Clara and demonstrated its IoT ASIC Platform that demonstrates end-to-end communication between sensor hubs and cloud platforms through a gateway device. The Industrial IoT system setup is a part of Open-Silicon's Spec2Chip IoT Platform, which allows IoT ASIC designs to be evaluated at system level...Click here for details...
  
Open-Silicon exhibited at the TSMC 2016 Tech. Symposium, in Boston, on Tuesday, March 22, 2016 to demonstrate its Industrial IoT ASIC Platform and 28Gbps SerDes Evaluation Platform...Click here for details...
  
Open-Silicon exhibited at the TSMC Tech. Symposium, in Austin, on March 24, 2016 and demonstrated its Industrial IoT ASIC Platform, 28Gbps SerDes Evaluation Platform and various other innovative ASIC solutions...Click here for details...
        
About Open-Silicon
   
Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers' products by innovating at every stage of design - architecture, logic, physical, system, software, and IP - and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing, and test capabilities. The company has partnered with over 150 companies ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300 designs and shipped over 120 million ASICs to date. Privately-held, Open-Silicon employs over 250 people in Silicon Valley and around the world. 
To know more visit: www.open-silicon.com

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