Open-Silicon Joins TSMC's Design Center Alliance

Integrated Platform Delivers Predictable, Reliable and Cost-effective ASICs

Sunnyvale, Calif. - August 24, 2005 -Open-Silicon, Inc., a fabless ASIC company that provides a predictable, reliable and cost-effective alternative to traditional chip design and supply-chain models, and Taiwan Semiconductor Manufacturing Company, Ltd. (TSM) (NYSE: TSM) today announced that Open-Silicon has joined the TSMC Design Center Alliance (DCA) program.

"Open-Silicon's mission is to provide a predictable, reliable and cost-effective ASIC solution" said Dr. Naveed Sherwani, President and CEO of Open-Silicon. "We have worked closely with TSMC since Open-Silicon's inception. This strong partnership has allowed us to provide customers with dramatically improved chances of right-first-time silicon. We are very happy to join TSMC's Design Center Alliance."

"The fabless ASIC business is a fast-growing model," said Rick Cassidy, president of TSMC North America. "By adding Open-Silicon to our Design Center Alliance, we continue to reduce risk at each step of the ASIC implementation process and improve time-to-market."

Open-Silicon takes projects from RTL, netlist or GDSll - then manages the entire process - from design engineering, IP procurement, fabrication, package assembly and test, silicon validation and production, through end-of-life.

About Open Silicon, Inc.
Open-Silicon, Inc. is a fabless ASIC company delivering the most cost-effective, predictable and reliable custom ASIC solution to electronics product customers worldwide. Open-Silicon's OpenMODEL™ is the semiconductor industry's first end-to-end custom ASIC solution based on a revolutionary business model that provides a seamless, low-cost, low risk alternative to traditional models for complex ASIC design and development. For more information, visit Open-Silicon's website at www.open-silicon.com or call 408-523-1200.

About TSMC Ltd.
TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry industry's largest portfolio of process-proven library, IP, design tools and reference flows. The company operates one advanced 300mm wafer fab, five eight-inch fabs and one six-inch wafer fab. TSMC also has substantial capacity commitments at two joint ventures fabs (VIS and SSMC) and its wholly-owned subsidiary, WaferTech. In early 2001, TSMC became the first IC manufacturer to announce a 90-nm technology alignment program with its customers. TSMC's corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC see www.tsmc.com.