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Interlaken IP : Ultra Scalable, High Speed, Serial Link-Based Chip-to-Chip Interface

Topic: “Interlaken IP : Ultra Scalable, High Speed, Serial Link-Based Chip-to-Chip Interface”

Interviewee: Devendra Godbole, Engineering Manager IP & SoC Development at Open-Silicon

Interviewer: Gabriele Saucier, CEO at Design And Reuse S.A.

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