A Revolution in Performance and Power

Micron’s HMC technology is a new architecture unique to the market today. It combines fast logic process technology with advanced DRAM, resulting in a memory system with revolutionary performance and power in a dramatically reduced footprint. As multi-core processing continues to advance semiconductor design to new levels, this technology provides memory and performance ideally suited to these next-generation systems.

The Real Difference is in the Cube

HMC will provide a revolutionary performance shift that will enrich next- generation networking and enable exaflop-scale supercomputing:

• Increased Bandwith – a single HMC can provide more than 15x the performance of a DDR3 module.
• Power Reductions – HMC is exponentially more efficient than current memory, using 70% less energy per bit than DDR3.
• Smaller physical systems – HMC’s stacked architecture uses nearly 90% less space than today’s RDIMMs.

Open-Silicon: Expanding the HMC Ecosystem

For Hybrid Memory Cube, Open-Silicon’s role is to function as an ecosystem developer, enabling ASIC and ASSP customers to quickly and easily access the revolutionary Hybrid Memory Cube technology. Open-Silicon served a similar role as a founding member of the Interlaken Alliance, a consortium developed in 2007 to drive a new standard for scalable high speed computer network connections. As an Interlaken Alliance consortium member, Open-Silicon has to date developed and delivered to market five generations of Interlaken IP solutions, enabling more than 35 licensees to benefit from the technology.

As a Developer member of the Hybrid Memory Cube Consortium, Open-Silicon focuses on three areas:

1. As an ecosystem developer, Open-Silicon is helping develop the HMC interface specification and developing HMC interface IP solutions.
2. As an independent non-DRAM company, Open-Silicon will offer interface applications engineering support to the market including reference designs, application notes, and consultation/review services.
3. As an ASIC company, Open-Silicon offers HMC-based ASIC design services including HMC interface integration and validation. To best leverage the technology, Open-Silicon also offers networking and high-performance computing companies comprehensive architecture and derivative IC development services.

Open-Silicon is working as part of the Hybrid Memory Cube Consortium to create a world-class Hybrid Memory Cube ecosystem with the necessary serial interfaces and controller IP for enabling rapid ASIC and CPU development, said Naveed Sherwani, president and CEO of Open-Silicon. With HMC’s ground-breaking memory technology and our IP and ASIC development capabilities we can enable a new level of system performance and integration.

Open-Silicon offers the right mix of networking and computing architectural knowledge, semiconductor development expertise, and software and emulation services to support an expanding ecosystem developing around this new memory technology, said Robert Feurle, VP DRAM Marketing of Micron.

Open-Silicon is a founder and developer member of the Hybrid Memory Cube Consortium.  The goal of the Consortium is to facilitate HMC Integration into a wide variety of systems, platforms and applications by defining an adoptable industry-wide interface that enables developers, manufacturers and enablers to leverage this revolutionary technology.

For more on the consortium, please visit http://hybridmemorycube.org/about.html or download the Consortium Overview.