Micron’s HMC technology is a new architecture unique to the market today. It combines fast logic process technology with advanced DRAM, resulting in a memory system with revolutionary performance and power in a dramatically reduced footprint. As multi-core processing continues to advance semiconductor design to new levels, this technology provides memory and performance ideally suited to these next-generation systems.
HMC will provide a revolutionary performance shift that will enrich next- generation networking and enable exaflop-scale supercomputing:
For Hybrid Memory Cube, Open-Silicon’s role is to function as an ecosystem developer, enabling ASIC and ASSP customers to quickly and easily access the revolutionary Hybrid Memory Cube technology. Open-Silicon served a similar role as a founding member of the Interlaken Alliance, a consortium developed in 2007 to drive a new standard for scalable high speed computer network connections. As an Interlaken Alliance consortium member, Open-Silicon has to date developed and delivered to market five generations of Interlaken IP solutions, enabling more than 35 licensees to benefit from the technology.
As a Developer member of the Hybrid Memory Cube Consortium, Open-Silicon focuses on three areas:
Open-Silicon is working as part of the Hybrid Memory Cube Consortium to create a world-class Hybrid Memory Cube ecosystem with the necessary serial interfaces and controller IP for enabling rapid ASIC and CPU development, said Naveed Sherwani, president and CEO of Open-Silicon. With HMC’s ground-breaking memory technology and our IP and ASIC development capabilities we can enable a new level of system performance and integration.
Open-Silicon offers the right mix of networking and computing architectural knowledge, semiconductor development expertise, and software and emulation services to support an expanding ecosystem developing around this new memory technology, said Robert Feurle, VP DRAM Marketing of Micron.