In the News
- December 15, 2011: System-Level Design - Model-Driven Design: Making Progress
- November 29, 2011: Semiconductor Design & Manufacturing - Experts at the Table: Stacked Die and the Supply Chain
- November 29, 2011: Fall 2011 Update
- November 01, 2011: Chipestimate.com Newsletter - The Challenges of Using Open Market IP in ASIC Designs
- October 26, 2011: Semiconductor Design & Manufacturing - Fabless ASIC Vendors to Expand Design Services
- October 21, 2011: Chipestimate.TV - Colin Baldwin Interview at GTC 2011
- October 20, 2011: Cadence Press Release: Open-Silicon win's Best Paper Award at CDNLive! India
- October 07, 2011: ElectronicsWeekly - Samsung leads firms in stacked DRAM initiative
- October 06, 2011: Semiconductor Design & Manufacturing - Micron, Samsung Form 3-D Memory Consortium
- October 06, 2011: GigaOM - Samsung and Micron’s new Hybrid Cube Memory tech is greener and faster
- September 28, 2011: EE Times - Open-Silicon takes broad ARM license
- September 22, 2011: System-Level Design - 20nm IP Portability Appears Virtually Impossible
- September 22, 2011: Electronic Design - Quell Those Jitters Caused By Tough Jitter Requirements
- August 22, 2011: Open-Silicon Adopts Magma's SiliconSmart ACE
- August 11, 2011: System-Level Design - Experts At The Table: Multi-Core and Many-Core; Part 3
- August 11, 2011: EDN - SOCs: IP is the New Abstraction
- July 29, 2011: System-Level Design - Experts At The Table: Multi-Core and Many-Core; Part 2
- July 21, 2011: System-Level Design - Experts At The Table: Multi-Core and Many-Core; Part 1
- July 17, 2011: Cadence Video: Open-Silicon CEO Warns of “Exponential Verification Nightmare”
- May 27, 2011: EDN - Open-Silicon offers a wager on schedules
- May 27, 2011: EE Times - ASIC prototypes on time—or your money back
- April 28, 2011: System-Level Design - SoC Ecosystems Become More Tightly Integrated
- March 10, 2011: EE Times - Open-Silicon updates its 'Interlaken' IP core
- March 01, 2011: Electronic Products - Design-lite leverages engineering partners
- February 02, 2011: EE Times - ESL, Anyone?
- February 01, 2011: Chip Design Magazine - No Respins, A Future of Collaborative Chip Design
- January 18, 2011: ECN -- Shrinking Design Cycles
- December 13, 2010: Forbes - Semiconductor’s Next Wave
- November 17, 2010: infoTECH - Open-Silicon Uses Cadence Silicon Realization Technology
- November 15, 2010: SMIC and Brite Semiconductor Collaborate to Provide Integrated IC Design and Manufacturing Services
- October 04, 2010: ECN - The Roundtable, The Recovery
- September 21, 2010: EE Times - MIPS, friends tape-out IC at 40nm for 2.4GHz
- September 08, 2010: EDN - A primer for successful integration of complex hard IP in physical design
- September 02, 2010: Open-Silicon Establishes Subsidiary in Kanagawa last March
- August 12, 2010: EDN - IP Integration: Is it the real system-level design?
- August 05, 2010: Cadence Industry Insights-Open-Silicon CEO: Addressing SoC/IP Integration Challenges
- June 10, 2010: GLOBALFOUNDRIES Launches Global Partner Ecosystem with Open-Silicon
- May 19, 2010: ElectronicsWeekly.com - The Company That Takes ASIC Specs Written On A Napkin
- May 13, 2010: ElectronicsWeekly.com - Days Of Humongous ASIC Volumes Are Gone...
- April 29, 2010: Virage Logic IP Times - Open-Silicon and Virage Logic Team For Low Power Solutions
- April 16, 2010: EDN - Contemplation as a Design Tool
- April 14, 2010: Synopsys IP OEM Partner Update
- January 12, 2010: EE Times - Open-Silicon Acquires Design Services Firm
- January 12, 2010: EDN - Open-Silicon adds Silicon Logic Engineering - for a good reason
- December 14, 2009: GSA - Open-Silicon is Most Respected Private Semiconductor Company for Second Year
- November 03, 2009: GSA - 2009 Nominees Announced for Most Respected Private Semiconductor Company
- August 06, 2009: EDN - Techniques for implementing high-performance processor cores
- May 20, 2009: EDN - NXP and Open-Silicon illustrate an interesting—and maybe prophetic—division of labor
- May 20, 2009: EE Times - The design debate: Art versus science
- April 16, 2009: Open-Silicon Awarded 3rd Place at Magma Users Summit (MUSIC)
- April 02, 2009: Chip Design Magazine - ASIC or FPGA: Why Not Plan For Portability?
- February 23, 2009: The Financal Express - Short Circuit
- February 04, 2009: Chip Design Magazine - Manage ASIC Variability through Back Biasing
- January 31, 2009: IP Designer Newsletter - Finding the Right Way to Prototype ASIC Designs
- January 12, 2009: EE Times - Open-Silicon Thriving and Hiring in Downturn
- December 15, 2008: GSA - Open-Silicon is Most Respected Private Semiconductor Company
- November 20, 2008: Synopsys Unveils IP OEM Partner Program with Open-Silicon
- November 13, 2008: EE Times - New Technologies Target Design Issues at 65, 45nm
- November 12, 2008: EDN - When an ASIC Vendor Partners with an EDA Vendor: a New Model
- November 04, 2008: ChipEstimate TechTalk - Successful Third-Party IP Integration: Science or Art?
- October 30, 2008: EDN - Multicore: the future of SOCs?
- September 30, 2008: MIPS Technologies Newsletter - Customer Spotlight: Open-Silicon Study on High-Speed MIPS32® 24Kc Implementation
- August 21, 2008: Chip Design Magazine - Converting FPGA Designs
- July 10, 2008: Synopsys User's Group (SNUG) - Open-Silicon's Aditya Ramachandran Wins Best Paper Award for Second Consecutive Year
- July 01, 2008: ECN Asia - On-chip SerDes Clock Distribution Implementation