What We Do
Open-Silicon provides leading edge semiconductor solutions to get customer’s products to market. These solutions include traditional ASIC design, derivative and platform SoCs, hardware and software design services, and production handoffs where Open-Silicon provides manufacturing operations. In addition to a broad menu of in-house engineering capabilities, Open-Silicon also utilizes the best-in-class engineering capabilities of partners like Synopsys, Cadence, S3, TSMC, ASE, and Wipro. By combining the specific expertise necessary for each design with the most appropriate open-market technologies, and managing the process through a single point of organization and ownership, Open-Silicon has raised collaborative engineering to a new level.Since its founding in 2003, the company has focused on raising the bar on SoC execution, measuring the quality of engineering work and the ability to hit customer schedules and reporting that to the board of directors at every board meeting. Also, the company has invested in technology, from the 2007 acquisition of Zenasis Technology, a leader in the processor performance space, to the 2009 acquisition of Silicon Logic Engineering, a leader in networking and computer system architecture, to the in-house developments of scan shift frequency scaling (TestMAX) and back biasing (VariMAX).
A Flexible Model
Open-Silicon’s OpenMODEL™ is the semiconductor industry’s first end-to-end custom SoC development solution based on a revolutionary business model that provides a seamless, low-cost, and low-risk alternative to traditional models for complex ASIC design and development. The OpenMODEL brings freedom of choice to the traditionally inflexible chip supply chain. Designers can choose their foundry technology, package solution, and IP from any available on the open market, or they can ask Open-Silicon to propose solutions based upon our IP qualification and design experience. We optimize the chip supply chain through a wide portfolio of fabrication process technologies, pre-qualified IP, package assembly, test solutions, and a world-class design, product engineering and operations team. This approach allows our customers to take advantage of an optimized structure that ensures low chip costs, reduced risk and faster time-to-market.
Maximize IC Investments
By utilizing its broad partner ecosystem and extensive design experience, Open-Silicon has developed an optimized enablement model for derivative IC designs, helping customers maximize the returns on their product line investment. By collaborating on derivative IC designs with Open-Silicon, chip companies can allow existing design teams to focus on strategic projects, while still enjoying the market position and revenue associated with the derivative ICs.