Innovative Memory Solutions Focus on Data Networking and High-Performance Computing
MILPITAS, Calif. and BOISE, Idaho: Open-Silicon, Inc. and Micron Technology, Inc. (Nasdaq:MU) today announced that the companies have entered into an agreement that will enable them to explore opportunities around Micron’s recently announced Hybrid Memory Cube (HMC) products. The companies will initially focus on the data networking and high-performance computing markets. Open-Silicon’s depth of knowledge in these verticals and its broad ecosystem for ASIC, ASSP, and derivative IC development, combined with Micron’s cutting-edge HMC technology, offer a unique opportunity to create next-generation memory solutions optimized for various markets.
Micron’s HMC technology is a new architecture unique to the market today. It combines fast logic process technology with advanced DRAM, resulting in a memory system with revolutionary performance and power in a dramatically reduced footprint. As multi-core processing continues to advance semiconductor design to new levels, this technology provides memory and performance ideally suited to these next-generation systems.
“Open-Silicon offers the right mix of networking and computing architectural knowledge, semiconductor development expertise, and software and emulation services to support an expanding ecosystem developing around this new memory technology,” said Robert Feurle, Micron vice president of DRAM Marketing.
“Micron has developed groundbreaking memory technology that will enable a new level of system performance and integration, as well as new classes of applications that we are only beginning to understand today. We are proud to work with Micron on supporting Hybrid Memory Cube technology, and are excited to know that these solutions will be valuable to the data networking and computing markets that Open-Silicon presently serves,” said Naveed Sherwani, president and CEO of Open-Silicon.
Micron Technology, Inc. is one of the world’s leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.
About Open-Silicon, Inc.
Open-Silicon is a leading semiconductor company focused on SoC realization for traditional ASIC, develop-to-spec, and derivative ICs. In support of the industry trend towards collaborative engineering and design-lite, Open-Silicon offers SoC architecture, system design, physical design, low-level software, and high-quality semiconductor manufacturing services with one of the world’s broadest partner ecosystems for IC development. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.
©2011 Micron Technology, Inc. All rights reserved. Information is subject to change without notice. “Micron” and the Micron logo are registered trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.
This press release contains forward-looking statements regarding Hybrid Memory Cube. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents Micron files on a consolidated basis from time to time with the Securities and Exchange Commission, specifically Micron’s most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for Micron on a consolidated basis to differ materially from those contained in our forward-looking statements (see Certain Factors). Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements.