Download or Request: 28G SerDes Evaluation Platform Virtual Prototyping Brochure HMC ASIC IP Product Brief

Open-Silicon Expands ASIC Architecture and RTL Design Team to Support Derivative SoC Solutions

New Collaborative Engineering Center in Research Triangle Park Opens to Meet Increasing Demand

MILPITAS, Calif. :  Open-Silicon, Inc., a leading ASIC design and semiconductor manufacturing company, announced today that it has opened an office in the Research Triangle Park (RTP), centrally located between Raleigh, Chapel Hill and Durham, North Carolina, to meet the increasing demand for derivative SoC solutions. The new engineering center will focus on ASIC architecture, RTL design and design verification as a part of the company’s existing derivatives design offering first launched several years ago with the development of an NXP chip in a record-breaking timeframe. Located near cutting edge universities and several large technology companies, the new development center provides Open-Silicon with an additional global facility to support its growing customer base with experienced system design engineers.

As a collaborative engineering partner, Open-Silicon offers the complex architecture, RTL design and design verification solutions required to enable turnkey and derivative SoC development. This allows customers to add revenue to an existing IC product line through modifications to that design without pulling the engineering team from its next generation core product roadmap focus. The net result is a greater return on the overall product line investment.

With the previously announced 2009 acquisition of  Silicon Logic Engineering (SLE), Open-Silicon grew the company’s solutions offering from physical design and manufacturing to include the complex architecture and RTL design required to build complex SoCs in vertical markets such as networking, telecom, storage and computing. The company’s expanded in-house engineering teams work with Open-Silicon’s existing design partners to meet the specific needs of each customer and design.

“Last year, when SLE joined Open-Silicon, we knew we had found a great front-end design team to compliment our comprehensive physical design team and design partners. Our customer response has been extremely positive to the integration of the derivatives design capabilities into our solutions offering,” said Scott Houghton, vice president marketing and business development at Open-Silicon. “Adding this new facility for front end design, in a location with ready access to top tier talent, will help us continue to meet our customers’ needs.”

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on SoC realization for traditional ASIC, develop-to-spec, and derivative ICs. Open-Silicon’s OpenMODEL brings together Open-Silicon’s engineering technology and high-quality manufacturing services with one of the broadest partner ecosystems for IC development, spanning IC design, open market IP integration, wafer fabrication, and assembly/test services. Open-Silicon received the Global Semiconductor Alliance (GSA) award for Most Respected Private Semiconductor Company in 2008 and 2009. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.